| PART |
Description |
Maker |
| CI160808-1N0D CI160808-1N2D CI160808-1N5D CI160808 |
Multi-Layer Chip Inductors 1 ELEMENT, 0.018 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.15 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.027 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.18 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.0022 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.0012 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.0068 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
|
Bourns Inc.
Bourns, Inc.
|
| AP9107 |
Analog Front-end Chip for Multi-cells Li Battery Pack
|
Diodes
|
| C1206C2745RAC C1206C6845RAC C1206C68415RAC C1206C3 |
Triple buffer with open-drain outputs, SOT505-2 (TSSOP8), Reel Pack, Reverse
3.3 V 16-bit buffer/driver; 3-state, SOT362-1 (TSSOP48), Tube
3.3 V 16-bit buffer/driver; 3-state, SOT1025-1 (HUQFN60U), Reel Dry Pack, 7" 表面贴装陶瓷电容扩展206，X7R介质500000伏特
Surface Mount Ceramic Chip Capacitors Extended Values 1206, X7R Dielectric, 25, 50, 100, 200 Volts 表面贴装陶瓷电容扩展206，X7R介质5500000伏特
Surface Mount Ceramic Chip Capacitors Extended Values 1206, X7R Dielectric, 25, 50, 100, 200 Volts 表面贴装陶瓷电容扩展206，X7R介质255000200伏特
|
KEMET Corporation
|
| DPS128X16AA3-35C DPS128X16AA3-45I DPS128X16AA3-45M |
128K X 16 MULTI DEVICE SRAM MODULE, 35 ns, CPGA50 STACK, CERAMIC, PGA-50
128K X 16 MULTI DEVICE SRAM MODULE, 45 ns, CPGA50 STACK, CERAMIC, PGA-50
|
Twilight Technology, Inc.
|
| TH50VSF3582AASB |
MULTI-CHIP INTEGRATED CIRCUIT SILICON GATE CMOS SRAM AND FLASH MEMORY MIXED MULTI-CHIP PACKAGE
|
TOSHIBA
|
| CYM4208HD-40MB CYM4208HD-40C |
64K X 9 MULTI DEVICE FIFO MODULE, 40 ns, DMA28
64K X 9 OTHER FIFO, 40 ns, CDIP28 0.600 INCH, CERAMIC, MODULE, DIP-28
|
Cypress Semiconductor, Corp.
|
| FDMF8700 |
Driver plus FET Multi-chip Module
|
Fairchild Semiconductor
|
| FDMF6730 |
Driver plus FET Multi-chip Module
|
Fairchild Semiconductor
|
| TH50VPN564 TH50VPN5640EBSB |
MULTI-CHIP INTEGRATED CIRCUIT SILICON GATE CMOS PSEUDO SRAM AND NAND E2PROM MEMORY MIXED MULTI-CHIP PACKAGE
|
TOSHIBA
|
| WS128K32NV-17H1MA WS128K32NV-17H1C WS128K32NV-17H1 |
128K X 32 MULTI DEVICE SRAM MODULE, 17 ns, CPGA66 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66
128K X 32 MULTI DEVICE SRAM MODULE, 20 ns, CPGA66 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66
128K X 32 MULTI DEVICE SRAM MODULE, 15 ns, CPGA66 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66
128K X 32 MULTI DEVICE SRAM MODULE, 25 ns, CPGA66 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66
128K X 32 MULTI DEVICE SRAM MODULE, 35 ns, CPGA66 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66
|
Microsemi, Corp.
White Electronic Designs, Corp.
|
| MCA104 |
Multi-Chip Array Two NPN and Two PNP High Speed / Medium Power Switching Transistors
MULTI-CHIP ARRAY TWO NPN AND TWO PNP HIGH SPEED, MEDIUM POWER SWITCHING TRANSISTORS IN A HERMETICALLY SEALED CERAMIC SURFACE MOUNT PACKAGE
|
Semelab PLC
SEME-LAB[Seme LAB]
|
|
