PART |
Description |
Maker |
FCLM375P08LD0 FCLM375P08LD1 FCLM375P08LD2 FCLM375P |
Fiber Coupled Laser Module
|
OPLINK Communications Inc.
|
SLT4466-XP/RH2-H885A SLT4460-CP/RH2-H260A SLT4466- |
FIBER OPTIC LASER DIODE MODULE EMITTER, 1368-1372nm, 2500Mbps, PANEL MOUNT, THROUGH HOLE MOUNT ROHS COMPLIANT PACKAGE FIBER OPTIC LASER DIODE MODULE EMITTER, 1408-1412nm, 2500Mbps, THROUGH HOLE MOUNT, SC/PC CONNECTOR ROHS COMPLIANT PACKAGE FIBER OPTIC LASER DIODE MODULE EMITTER, 1367-1373nm, 2500Mbps, PANEL MOUNT, THROUGH HOLE MOUNT FIBER OPTIC LASER DIODE MODULE EMITTER, 1348-1352nm, 2500Mbps, PANEL MOUNT, THROUGH HOLE MOUNT FIBER OPTIC LASER DIODE MODULE EMITTER, 1528-1532nm, 2500Mbps, THROUGH HOLE MOUNT, SC/PC CONNECTOR FIBER OPTIC LASER DIODE MODULE EMITTER, 1528-1532nm, 2500Mbps, PANEL MOUNT, THROUGH HOLE MOUNT
|
Japan Aviation Electronics Industry, Ltd. Cooper Bussmann, Inc.
|
G145PU23W |
High Power Fiber Coupled Infrared Laser Diode
|
Roithner LaserTechnik GmbH
|
1060-1100 1050-1150 |
High-Power 10 W 9xx nm Fiber-Coupled Diode Laser
|
JDS Uniphase Corporation
|
G081PU25W |
High Power Fiber Coupled Infrared Laser Diode
|
Roithner LaserTechnik GmbH
|
L4-9891510-100E L4-9891510-100F L4-9894010-100E L4 |
High-Power 10 W 9xx nm Fiber-Coupled Diode Laser with Feedback Protection
|
JDS Uniphase Corporation
|
C-13-010-TG-SLC2B C-13-010-TJ-SLC2B C-13-010-TK-SL |
FIBER OPTIC LASER DIODE MODULE EMITTER, 1295-1325nm, 10000Mbps, THROUGH HOLE MOUNT, TO-18, LC CONNECTOR FIBER OPTIC LASER DIODE MODULE EMITTER, 1295-1325nm, 10000Mbps, THROUGH HOLE MOUNT, TO-18, SC CONNECTOR 10Gbps 1310 nm MQW-FP Laser Diode Module-TOSA
|
ETC List of Unclassifed Manufacturers
|
SLT4310-QS/RH1 SLT4310-XN |
FIBER OPTIC DFB LASER MODULE EMITTER, 1500-1600nm, PANEL MOUNT, THROUGH HOLE MOUNT, SC/PC CONNECTOR ROHS COMPLIANT PACKAGE FIBER OPTIC DFB LASER MODULE EMITTER, 1500-1600nm, THROUGH HOLE MOUNT
|
Electronic Theatre Controls, Inc.
|
OL3204N-40 OL3201N-40 |
FIBER OPTIC LASER DIODE MODULE EMITTER, 1280-1330nm, THROUGH HOLE MOUNT, FC CONNECTOR 1.3 レm High-Power Laser-Diode DIP Module 1.3レ米高功率激光二极管双酯模块 Circular Connector; MIL SPEC:MIL-C-26482, Series I, Solder; Body Material:Aluminum; Series:PT02; Number of Contacts:4; Connector Shell Size:8; Connecting Termination:Solder; Circular Shell Style:Box Mount Receptacle 1.3レ米高功率激光二极管双酯模块 1.3 μm High-Power Laser-Diode DIP Module 1.3 m High-Power Laser-Diode DIP Module
|
LAPIS SEMICONDUCTOR CO LTD OKI SEMICONDUCTOR CO., LTD. OKI[OKI electronic componets] OKI electronic components
|
NX8561JC NX8501CC-BA NX8501BC-BA NX8501AC-BA NX856 |
1 510 nm OPTICAL FIBER COMMUNICATIONS InGaAsP STRAINED MQW DC-PBH LASER DIODE MODULE InGaAsP STRAINED DC-PBH LASER DIODE MODULE 1 625 nm TELEMETRY APPLICATION
|
NEC[NEC]
|