| PART |
Description |
Maker |
| RTP21025-11 |
This HPA Module is a high gain and compact amplifier module for WCDMA and LTE Repeater use.
|
RFHIC
|
| RTP21005-11 |
This HPA Module is a high gain and compact amplifier module for WCDMA and LTE Repeater use.
|
RFHIC
|
| RFP-0850-33-27 |
HPA Module
|
RFHIC
|
| RFP-0895-27-27PS |
HPA Module
|
RFHIC
|
| TGA2904-EPU-FL |
Packaged Ku-band HPA
|
TriQuint Semiconductor
|
| TGA4501-SCC |
24-31 GHz Ka Band HPA
|
TriQuint Semiconductor,Inc.
|
| TGA4916-15 |
7 Watt Ka-Band HPA
|
TriQuint Semiconductor
|
| TGA2509-EPU-FL TG2509-EPU-FL |
Wideband Packaged HPA with AGC
|
TRIQUINT[TriQuint Semiconductor]
|
| VZC-6965B5 |
CPI 2.25kW TWT C-Band HPA
|
Communications & Power Industries, Inc.
|
| EV42-160-22-SERIES EV44-100-22-SERIES EV44-160-22- |
TLC2555 Evaluation Module
TLC4545 Evaluation Module
TLC2551 Evaluation Module
CC1000DK-868/915 MHz Development Kit
CC2400DK Development Kit
TPA0172 Evaluation Module
Radiomodem 433 MHz
CC2400DBK Demonstration Board Kit
CC1000PP 433 MHz Plug and Play Module
Digital Data Capture and Analysis for High Speed, High Resolution A to D Converters
ADS1244 Evaluation Module
SN65HVD22EVM Evaluation Module
Peripheral IC 外围芯片
|
Infineon Technologies AG
NXP Semiconductors N.V.
Amphenol, Corp.
Xicon Passive Components
Electronic Theatre Controls, Inc.
|
| HYM72V8030GS-60 HYM72V8030GS-50 HYM72V8020GS-60 HY |
8M x 72 Bit ECC FPM DRAM Module buffered
8M x 72-Bit Dynamic RAM Module (ECC - Module)
8M x 72-Bit Dynamic RAM Module 8M X 72 FAST PAGE DRAM MODULE, 60 ns, DMA168
Tools, Hand Crimp; Leaded Process Compatible:No; Peak Reflow Compatible (260 C):No
|
SIEMENS[Siemens Semiconductor Group]
Infineon
SIEMENS AG
SIEMENS A G
|
