| PART |
Description |
Maker |
| C3216X7S2A225MT |
SPECIFICATION FOR TDK MULTILAYER CERAMIC CHIP CAPACITORS
|
TDK Electronics
|
| C3225X7S2A335KT |
SPECIFICATION FOR TDK MULTILAYER CERAMIC CHIP CAPACITORS
|
TDK Electronics
|
| C3225X7S2A335MT |
SPECIFICATION FOR TDK MULTILAYER CERAMIC CHIP CAPACITORS
|
TDK Electronics
|
| C2012X7S2A105KT |
SPECIFICATION FOR TDK MULTILAYER CERAMIC CHIP CAPACITORS
|
TDK Electronics
|
| C1005X7S2A103MT |
SPECIFICATION FOR TDK MULTILAYER CERAMIC CHIP CAPACITORS
|
TDK Electronics
|
| GLF2012T220K GLF251812T220M GLC2518T101K GLF2518T1 |
GLF,GLC Series
TDK’s New Winding Type Chip Inductor
|
TDK Electronics
|
| 2SC1816 |
SPECIFICATION TRANSISTORSS,DIODES
From old datasheet system
SPECIFICATION TRANSISTORS,DIODES
SPECIFICATION TRANSISTORSS / DIODES
|
Unknow
ETC[ETC]
|
| 55A0812 |
This specification sheet forms a part of the latest issue of Raychem Specification 55A.
|
TE Connectivity Ltd
|
| 55PC1223 |
This specification sheet forms a part of the latest issue of Raychem Specification 55PC.
|
Tyco Electronics
|
| 749010013 744761068A |
All 16 terminals must lie on a plane within 004 of surface A after lead tinning
specification for release
specification for release
|
Wurth Elektronik GmbH & Co. KG, Germany.
Wurth Elektronik GmbH &...
|
| MPC755BTXPND MPC755BTXPNS XPC755BRX400TE XPC755BRX |
MPC755 Part Number Specification for the XPC755BxxnnnTx Series
Part Number Specification for the XPC755BxxnnnTx Series
|
Motorola
|
| MPC8240RZUPND MPC8240RZUPNS |
MPC8240 Part Number Specification for the XPC8240RZUnnnx Series
Part Number Specification for the XPC8240RZUnnnx Series
|
Motorola
|
