| PART |
Description |
Maker |
| PVB5VBV PVB5VBW PVB5VFV PVB5VFW PVB5WBV PVB5WBW PV |
6 Pad Leadless Surface Mount or 4 Lead Thru-Hole PECL Voltage Controlled Xtal Oscillator
|
ETC
List of Unclassifed Manufacturers
|
| UVV10Z5LN UVV20Z5LN UVV60Z5LN UVV10R1HN UVV10R1LN |
5x7 mm, 3.3 Volt, LVPECL/LVDS, VCXO
VCXO, CLOCK, 0.75 MHz, LVDS OUTPUT ROHS COMPLIANT, CERAMIC LEADLESS PACKAGE-6
VCXO, CLOCK, 0.75 MHz, PECL OUTPUT ROHS COMPLIANT, CERAMIC LEADLESS PACKAGE-6
VCXO, CLOCK, 800 MHz, PECL OUTPUT ROHS COMPLIANT, CERAMIC LEADLESS PACKAGE-6
VCXO, CLOCK, 800 MHz, LVDS OUTPUT
|
MTRONPTI
|
| IL3X-HX5F12.5-32.768 |
2 Pad Ceramic Package, 1.5 mm x 3.2 mm
|
ILSI America LLC
|
| MGF4953B |
SUPER LOW NOISE InGaAs HEMT Leadless Ceramic Package
|
Mitsubishi Electric Semiconductor
|
| 495-28.0M-3DN-T 495-28.0M-5DN-T 495-28.0M-5EN-T 73 |
5 x 7 Ceramic 6 Pad PECL Output
|
Oscilent Corporation
|
| WCSMCFC-32.768KHZ- WCSMCF-32.768KHZ-6 WCSMCC-32.76 |
4 Pad Ceramic SMD Package
|
MMD Components
http://
|
| 1206J6300180KCT 1206J6300180KCR 1206J6300101KCR 12 |
CAPACITOR, CERAMIC, MULTILAYER, 630 V, C0G, 0.000018 uF, SURFACE MOUNT, 1206 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 630 V, C0G, 0.0001 uF, SURFACE MOUNT, 1206 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 630 V, C0G, 0.0000015 uF, SURFACE MOUNT, 1206 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 630 V, C0G, 0.000001 uF, SURFACE MOUNT, 1206 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 630 V, C0G, 0.000022 uF, SURFACE MOUNT, 1206 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 630 V, C0G, 0.00015 uF, SURFACE MOUNT, 1206 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 630 V, C0G, 0.00001 uF, SURFACE MOUNT, 1206 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 630 V, C0G, 0.001 uF, SURFACE MOUNT, 1206 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 630 V, C0G, 0.00012 uF, SURFACE MOUNT, 1206 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 630 V, C0G, 0.0000012 uF, SURFACE MOUNT, 1206 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 630 V, C0G, 0.00018 uF, SURFACE MOUNT, 1206 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 630 V, C0G, 0.000012 uF, SURFACE MOUNT, 1206 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 630 V, C0G, 0.0000018 uF, SURFACE MOUNT, 1206 CHIP
|
Syfer Technology, Ltd.
|
| CR1209X7R104Z3F5 CR1209X7R104Z3NG5 CR1209X7R104Z3F |
CAPACITOR, CERAMIC, MULTILAYER, 100 V, X7R, 0.1 uF, SURFACE MOUNT, 1209 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 100 V, BX, 0.00047 uF, SURFACE MOUNT, 0402 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 16 V, BX, 0.0056 uF, SURFACE MOUNT, 0603 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 16 V, BX, 0.0022 uF, SURFACE MOUNT, 0402 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 50 V, BX, 0.0033 uF, SURFACE MOUNT, 0603 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 100 V, BX, 0.0012 uF, SURFACE MOUNT, 0603 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 50 V, BX, 0.001 uF, SURFACE MOUNT, 0402 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 25 V, BX, 0.0015 uF, SURFACE MOUNT, 0402 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 25 V, BX, 0.0047 uF, SURFACE MOUNT, 0603 CHIP
|
Presidio Components, Inc.
|
| SSC-UR202 |
Surface-mounted and leadless chip LED device
|
Seoul Semiconductor
|
| M152 |
Surface Mount Leadless Chip Carrier Oscillators
|
Xsis Electronics
|
|
