| PART |
Description |
Maker |
| AT24C64CY6-YH-T AT24C64CN-SH-B AT24C32C-TH-B |
8 ULTRA THIN SAP, PB/HALO FREE, 1.8V(SERIAL EE) 8K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8
8 SOIC, PB/HALO FREE,1.8V(SERIAL EE) 8K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8
8 TSSOP, PB/HALO FREE, 1.8V(SERIAL EE) 4K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8
|
Atmel, Corp.
|
| AM29LV800BT-80DTC2 AM29LV800BT-80DGI2 AM29LV800BT- |
25NS,OTP CERDIP,883C; LEV B FULLY CMPLNT(EPLD)
20NS, OTP, PLCC, COM TEMP(EPLD)
20NS, SOIC, IND TEMP(EPLD)
25NS, SOIC, COM TEMP(EPLD)
20NS,OTP LCC,883C; LEVEL B FULLY CMPLNT(EPLD)
10MHZ, 8 DIP, COM TEMP(FPGA)
10MHZ, 20 PLCC, IND TEMP(FPGA)
10MHZ, 32 TQFP, COM TEMP(FPGA)
10MHZ, 44 PLCC, COM TEMP(FPGA)
30MHZ, 3.3V, 20 PLCC, COM TEMP(FPGA)
8 TSSOP,PB/HALO FREE,IND,1.8V(SERIAL EE)
DIE SALE, 1.8V, 11 MIL(SERIAL EE)
8 PDIP,PB/HALO FREE,IND TEMP,1.8V(SERIAL EE)
65K CONFIG MEM, 20 PLCC, IND TEMP(FPGA)
10MHZ, 20 SOIC, IND TEMP(FPGA)
128K CONFIG MEM, 20 PLCC, COM(FPGA)
EEPROM EEPROM
10MHZ, 8 NSOIC, COM TEMP(FPGA) EEPROM
512K X 16 FLASH 3V PROM, 120 ns, UUC44
10MHZ, 8 LAP, 5K MOQ(FPGA)
10MHZ, 8 N-SOIC, COM TEMP(FPGA)
10MHZ, 20 PLCC, COM TEMP(FPGA)
512K X 16 FLASH 3V PROM, 80 ns, UUC44
|
ADVANCED MICRO DEVICES INC
|
| AM3090-70MP175 AM3090-70MP84 AM3020-50CP175 AM3020 |
8-SOIC (NARROW BODY) IND TEMP, GREEN(BIOS FLASH)
8-MLF (NARROW BODY) IND TEMP GREEN(BIOS FLASH)
10MS, 8 EIAJ SOIC, AUTO TEMP, 2.7V(SERIAL EE)
10MS, DIE, 1.8V, 11 MILS(SERIAL EE)
10MS, DBGA2, INT TEMP, GREEN, 1.8(SERIAL EE)
10MS, 8 MAP, IND TEMP, GREEN, 1.8V(SERIAL EE)
ASIC 专用集成电路
|
Linear Technology, Corp.
|
| PUMA2US2500I-2512 PUMA2US2500I-2510 PUMA2US2500I-2 |
10MS, 8 PDIP, IND TEMP, GREEN, 1.8V(SERIAL EE)
10MS, 8 EIAJ SOIC, IND TEMP, GREEN, 2.7V(SERIAL EE)
10MS, 8 SOIC, EXT TEMP, GREEN, 2.7V(SERIAL EE)
10MS, 8 SOIC, IND TEMP, GREEN, 2.7(SERIAL EE)
10MS, 8 TSSOP, IND TEMP, GREEN, 2.7(SERIAL EE)
10MS, 8 TSSOP, EXT TEMP, GREEN, 2.7V(SERIAL EE)
10MS, 8 SOIC, IND TEMP, GREEN, 2.7V(SERIAL EE)
10MS, DIE, 2.7V, 11 MILS THICKNESS(SERIAL EE)
10MS, 8 MINI-MAP, IND TEMP, GREEN, 1.8V(SERIAL EE)
10MS, 8 LAP, IND TEMP, GREEN, 2.7V(SERIAL EE)
SRAM/EPROM 静态存储器/存储
10MS, DIE, 1.8V, 11 MILS THICKNESS(SERIAL EE) 静态存储器/存储
|
TDK, Corp.
TE Connectivity, Ltd.
|
| CAT24AC128J-1.8 CAT24AC128JI-1.8 CAT24AC128J-1.8TE |
16K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8 0.150 INCH, MS-012, SOIC-8
16K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO14 TSSOP-14
16K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8 0.210 INCH, LEAD AND HALOGEN FREE, EIAJ, SOIC-8
16K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8 0.150 INCH, LEAD AND HALOGEN FREE, MS-012, SOIC-8
16K X 8 I2C/2-WIRE SERIAL EEPROM, PDIP8
|
NXP Semiconductors N.V.
|
| DS9106L-YL0 DS9106S-YL0 DS9106L-PK0 DS9106S-PK0 DS |
iButton Halo
|
MAXIM - Dallas Semiconductor
|
| AM29LV800BB-120WBI AM29LV800BB-120WBC AM29LV800BB- |
30MHZ, 3.3V, 44 TQFP, IND TEMP(FPGA)
30MHZ, 3.3V, 20 PLCC, COM TEMP(FPGA)
30MHZ, 3.3V, 20 PLCC, IND TEMP(FPGA)
8-TSSOP,AUTO,Pb/HALO FREE,NIPDAU LF 2.5V(SERIAL EE)
10MHZ, 20 SOIC, COM TEMP, 5K MOQ(FPGA)
10MHZ, 20 SOIC, IND TEMP, 5K MOQ(FPGA)
30MHZ, 3.3V, 44 PLCC, COM TEMP(FPGA)
30MHZ, 3.3V, 44 TQFP, COM TEMP(FPGA)
30MHZ, 8 LAP, IND TEMP, GREEN(FPGA) x8/x16闪存EEPROM
x8/x16 Flash EEPROM x8/x16闪存EEPROM
32M CONFIG FLASH, 44 PLCC, GREEN(FPGA) x8/x16闪存EEPROM
512K X 16 FLASH 3V PROM, 120 ns, PDSO44
512K X 16 FLASH 3V PROM, 120 ns, PDSO48
10MHZ, 8 PDIP, COM TEMP, 5K MOQ(FPGA)
|
Analog Devices, Inc.
ADVANCED MICRO DEVICES INC
|
| CXA2202N |
EIAJ Sound Multiplexing Decoder
|
Sony Corporation
|
| 50-00048 |
Connector, dc plug, 5.5x3.3x1.0xL19 mm, EIAJ-4, molding style
|
Tensility International...
|
| 08-350000-11-RC 14-350000-11-RC 16-350000-11-RC 18 |
SOCKET ADAPTR SOIC/8PIN .300 DIP
SOCKET ADPTR SOIC/16PIN .300 DIP
SOCKET ADPTR SOIC/28PIN .300 DIP
RoHS/WEEE-Compliant SOIC-to-DIP Adapter
|
ARIES ELECTRONICS INC
Aries Electronics, Inc.
|
| MSA20 |
20-Lead Shrink Small Outline Package (SSOP), EIAJ TYPE II, 5.3mm Wide Package Number MSA20 20 -铅收缩小型封装（SSOP封装），EIAJ型二.3mm宽包MSA20
|
Fairchild Semiconductor, Corp.
Fairchild Semiconductor Corporation
|
|
