| PART |
Description |
Maker |
| PG-TO251-3-21 |
Package Outline / Marking Layout
|
Infineon
|
| P2NQ |
For suggested pad layout, see drawing: PAD-01
|
All Sensors Corporation
|
| P2NS |
For suggested pad layout, see drawing: PAD-01
|
All Sensors Corporation
|
| SMC MINIMELF SMA SOD-123 SOD-323 SOD-523 SMB DFN10 |
SUGGESTED PAD LAYOUT
|
Diodes Incorporated
|
| 1417 |
Bulk Metal Foil Technology, 8 Pin Transistor Outline Hermetic Resistor Network, Alternative Layout to Model 1413
|
Vishay
|
| USPQ-4B03 |
Package Information / Reference Pattern Layout Dimensions
|
Torex Semiconductor
|
| SC70-5 |
Surface mounted / 5 pin package Package outline
|
Zetex Semiconductors
|
| AP2305AGN-HF |
3.2 A, 30 V, 0.06 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp.
Advanced Power Electronics Corp.
|
| ILCX09-GI1F18-20.000 ILCX09-HF3F18-20.000 ILCX09-B |
2 Pad Ceramic Package Quartz Crystal, 3.5 mm x 6 mm
|
ILSI America LLC
|
| TQFN5X5-32 |
Package Outline
|
Global Mixed-mode Techn...
|
