| PART |
Description |
Maker |
| HDMP-3001 HDMP-3001K |
Telecommunication IC
HDMP-3001K · Evaluation Board for Multi-Protocol IC (MPIC) Ethernet Over SONET/SDH (EOS) Mapper
HDMP-3001 · Multi-Protocol IC (MPIC) Ethernet Over SONET/SDH (EOS) Mapper: Fast Ethernet to OC-3
|
Agilent (Hewlett-Packard)
|
| HDMP-1536A HDMP-1546A |
Fibre Channel Transceiver Chip(光纤通道收发器芯
HDMP-1536A · 1.0625 GBd Fibre Channel 10x10 mm QFP Transceiver Chip (Recommend HDMP-1636A for new designs)
|
Agilent (Hewlett-Packard)
|
| HDMP-2630B HDMP-2631B |
HDMP-2630B · 1.0625-2.125 GBd Serdes Circuits for Fibre Channel/Storage Applications: SSTL_2
HDMP-2631B · 1.0625-2.125 GBd Serdes Circuits for Fibre Channel/Storage Applications: SSTL_3
|
Agilent (Hewlett-Packard)
|
| HDMP-0450 |
HDMP-0450 · 1.0625-1.25 GBd Quad Port Bypass Circuit with Signal Detect for FC/Storage and GbE Applications
|
Agilent (Hewlett-Packard)
|
| MB4514 |
Telecommunication IC
|
Fujitsu
|
| RCV288ACIW/SVD RCV288ACI/A/SVD |
Telecommunication IC 通信集成电路
|
Electronic Theatre Controls, Inc.
Raltron Electronics, Corp.
|
| HFBR-5204F HFBR-5204TF HFBR-5205TF |
Telecommunication IC 通信集成电路
|
TOKO, Inc.
Mitsubishi Electric, Corp.
|
| XR2943CQ |
Telecommunication IC 通信集成电路
|
DB Lectro, Inc.
|
| LB1019AB |
Telecommunication IC 通信集成电路
|
Sony, Corp.
|
| UM82C550 |
Telecommunication IC 通信集成电路
|
OKI SEMICONDUCTOR CO., LTD.
|
| BU65612P0-140 BU65612P0-300 BU65612P0-120 |
Telecommunication IC 通信集成电路
|
Abracon, Corp.
|
