| PART |
Description |
Maker |
| ROK104022 ROK104001 ROK104021 |
Bluetooth MULTI CHIP MODULE
|
Infineon Technologies A...
Infineon Technologies AG
|
| DFBM-CF320 |
A Class 2 Bluetooth module compliant with Bluetooth Specification V2.0 EDR for various application
|
List of Unclassifed Manufacturers
ETC
|
| STLC2500 |
BLUETOOTH™ SINGLE CHIP
BLUETOOTH?/a> SINGLE CHIP
BLUETOOTH SINGLE CHIP
BLUETOOTH⑩ SINGLE CHIP
|
STMICROELECTRONICS[STMicroelectronics]
ST Microelectronics
|
| MC-7832-HA MC-7832-HA-AZ |
GaAs MULTI-CHIP MODULE
|
NEC
|
| CMCM |
Ceramic Multi-Chip Module Package
|
Amkor Technology, Inc.
|
| AT68166F |
Rad Hard 16 MegaBit 3.3V SRAM Multi-Chip Module
|
ATMEL Corporation
|
| WEDPNF8M722V-1010BC WEDPNF8M722V-1015BC WEDPNF8M72 |
8Mx72 Synchronous DRAM 16Mb Flash Mixed Module Multi-Chip Package
|
WEDC[White Electronic Designs Corporation]
|
| AS8FLC2M32BP-90_IT AS8FLC2M32BP-90_Q AS8FLC2M32BP- |
Hermetic, Multi-Chip Module (MCM) 64Mb, 2M x 32, 3.3Volt Boot Block FLASH Array
|
Austin Semiconductor
http://
|
| AB1120 |
Bluetooth 3.0 Single Chip
|
Airoha
|
| BTM312 |
Bluetooth Module
|
BUDDIES TECHNOLOGY LIMI...
|
