| PART |
Description |
Maker |
| HCPL-817-36DE HCPL-817-36CE HCPL-817-36AE HCPL-817 |
Phototransistor Optocoupler High Density Mounting Type
|
AVAGO TECHNOLOGIES LIMITED
AVAGO TECHNOLOGIES LIMI...
|
| HCPL-817 HCPL-817-0 HCPL-817-3 HCPL-817-5 HCPL-817 |
Phototransistor Optocoupler High Density Mounting Type 光电晶体管光电耦合器高密度安装类型
|
TE Connectivity, Ltd.
Avago Technologies, Ltd.
Diodes, Inc.
HP[Agilent(Hewlett-Packard)]
Agilent (Hewlett-Packard)
|
| PC845 |
High Sensitivity, High Density Mounting Type Photocoupler
|
Sharp Electrionic Compo...
|
| PC861 |
High Collector-emitter Voltage/ High Density Mounting Type Photocoupler
High Collector-emitter Voltage High Density Mounting Type Photocoupler
High Collector-emitter Voltage, High Density Mounting Type Photocoupler
|
SHARP[Sharp Electrionic Components]
|
| LTV-819-2S-TA LTV-819-2S-TA1 LTV849-V LTV849M-V LT |
High Density Mounting Type Photocoupler
High Density Mounting Type Photocoupler
|
Shenzhen Tenand Technology Co., Ltd.
Shenzhen Tenand Technol...
|
| HSM107S |
MPAK package is suitable for high density surface mounting and high speed assembly.
|
TY Semiconductor Co., Ltd
|
| HSB88WA |
CMPAK package is suitable for high density surface mounting and high speed assembly
|
TY Semiconductor Co., Ltd
|
| HSM88ASR |
MPAK package is suitable for high density surface mounting and high speed assembly
|
TY Semiconductor Co., Ltd
|
| LTV-354T |
Hybrid substrates that require high density mounting
|
Lite-On Technology Corporation
|
| HSU88 |
Ultra small Resin Package (URP) is suitablefor high density surface mounting and high speed assembly
|
TY Semiconductor Co., Ltd
|
