| PART |
Description |
Maker |
| WBSC0504-22NF-50V |
Wire Bonding Silicon Vertical Capacitor
|
Micross Components
|
| M570 |
Bonding, Handling, and Mounting Procedures for Millimeterwave PHEMT MMIC’s
|
M/A-COM Technology Solutions, Inc.
|
| S8650 |
Si PIN photodiode Flat surface ideal for bonding to scintillator
|
Hamamatsu Corporation
|
| PC1602G-P2 PC1602-G-P2 |
2 lines; 16 characters; dot size:0.55 x 0.50; dot pitch:0.60 x 0.55; LCD monitor
OUTLINE DIMENSION & BLOCK DIAGRAM 外形尺寸
OUTLINE DIMENSION & BLOCK DIAGRAM
|
Powertip Technology, Corp.
Powertip Technology Corp.
POWERTIP[Powertip Technology]
http://
|
| MMM-A-134 |
Metal to Metal Structural Bonding
|
ETC
|
| PC1604-A |
OUTLINE DIMENSION & BLOCK DIAGRAM
OUTLINE DIMENSION & BLOCK DIAGRAM
|
Powertip Technology Corp.
POWERTIP[Powertip Technology]
|
| PG160160-C |
OUTLINE DIMENSION & BLOCK DIAGRAM
OUTLINE DIMENSION & BLOCK DIAGRAM
|
Powertip Technology Corp.
POWERTIP[Powertip Technology]
|
| SC12N81-1G |
Diamond Bonding and Grounding Hardware
|
List of Unclassifed Man...
|
| TQ5M31K |
BLOCK DIAGRAM
|
TRIQUINT[TriQuint Semiconductor]
|
| AM386DX |
Am386DX Block Diagram
|
Advanced Micro Devices
|
