| PART |
Description |
Maker |
| FP7G75US60 |
Transfer Molded Type IGBT Module; ; No of Pins: 7; Container: Rail 75 A, 600 V, N-CHANNEL IGBT
|
Fairchild Semiconductor, Corp.
|
| 1MBK50D-060S |
Molded IGBT
|
FUJI[Fuji Electric]
|
| 1MBK30D-060S |
Molded IGBT
|
FUJI[Fuji Electric]
|
| STGIPS10K60A |
IGBT intelligent power module (IPM) 10 A, 600 V, DBC isolated SDIP-25L molded
|
STMicroelectronics
|
| STGIPS14K60 |
IGBT intelligent power module (IPM) 12 A, 600 V, DBC isolated, SDIP-25L molded
|
STMicroelectronics
|
| STGIPS20K60 |
IGBT intelligent power module (IPM) 17 A, 600 V, DBC isolated SDIP-25L molded
|
STMicroelectronics
|
| HLS322-29GG LS648-04TG HLS324-04GG HLS640-29TG HLS |
22 POS MOLDED DIP SOCKET DIP22, IC SOCKET
48 POS MOLDED DIP SOCKET DIP48, IC SOCKET
24 POS MOLDED DIP SOCKET DIP24, IC SOCKET
24 POS MOLDED DIP SOCKET DIP64, IC SOCKET
40 POS MOLDED DIP SOCKET DIP40, IC SOCKET
32 POS MOLDED DIP SOCKET DIP32, IC SOCKET
32 POS OPEN FRAME MOLDED DIP SOCKET DIP32, IC SOCKET
14 POS MOLDED DIP SOCKET DIP14, IC SOCKET
22 POS OPEN FRAME MOLDED DIP SOCKET DIP22, IC SOCKET
20 POS MOLDED DIP SOCKET DIP40, IC SOCKET
DIP8, IC SOCKET
|
Advanced Interconnections, Corp.
ADVANCED INTERCONNECTIONS CORP
|
| FP7G100US60 |
Transfer Moded Type IGBT Module
Transfer Molded Type IGBT Module
|
Fairchild Semiconductor
|
| T323A474J035AS-C T323A474J035AT-C T323A474K035AS-C |
TANTALUM MOLDED
DISSIPATION FACTOR: Maximum DF limits are shown in corresponding series part number listings on pages 44-48. See Application Notes Section, page 76 for addi-tional
PERFORMANCE CHARACTERISTICS
TANTALUM MOLDED / AXIAL ?MIL-PRF-49137/1&5
TANTALUM MOLDED / AXIAL . MIL-PRF-49137/1&5
|
Kemet Corporation
|
| SOMC |
Dual Inline Package, Small Outline Molded DIP, 14, 16, or 20 Pins, Rugged, Molded Case Construction, Highly Stable, Automatic Surface Mount Compatible, Reduces Assembly Costs,
|
Vishay
|
| 271F 271G MDP14 MDP16-01-101G MDP16-01-101J MDP16- |
Dual Inline Package, Molded DIP, 01, 03, 05 Schematics, Rugged, Molded Case Construction, Highly Stable, Automatic Insert Compatible, Uniform Performance Characteristics, Available in Tube Pack
Thick Film Resistor Networks Dual-In-Line Molded DIP 01 03 05 Schematics
(MDP14 / MDP16) Thick Film Resistor Networks
Sound/Security Multiconductor Cable; Number of Conductors:2; Conductor Size AWG:18; No. Strands x Strand Size:7 x 26; Jacket Material:Polyvinylchloride (PVC); Leaded Process Compatible:Yes; Capacitance:65pF/ft RoHS Compliant: Yes
Thick Film Resistor Networks, Dual-In-Line, Molded DIP, 01, 03, 05 Schematics 厚膜电阻网络，双列直插，模压浸，0135电路
|
VISAY[Vishay Siliconix]
Vishay Intertechnology,Inc.
Vishay Intertechnology, Inc.
|
|
