| PART |
Description |
Maker |
| FO-EX-2LCBD1 FO-EX-2LCBD2 |
FRONT HOUSING SYNTHETIC RESIN
|
Japan Aviation Electronics Industry, Ltd.
|
| CONT-GTC16S-A528 031-50600-002 |
CLIP - SYNTHETIC RESIN
|
Japan Aviation Electronics Industry, Ltd.
|
| 50-57-9211 |
SL?Crimp Housing, Single Row, Version C, Front Ribs, 11 Circuits
|
Molex Electronics Ltd.
|
| 50-57-9203 |
SL?Crimp Housing, Single Row, Version C, Front Ribs, 3 Circuits
|
Molex Electronics Ltd.
|
| N8201A |
Synthetic Instrument Module
|
Agilent(Hewlett-Packard)
|
| 50-57-9224 0050579224 |
2.54mm (.100") Pitch SL Crimp Housing, Single Row, Version C, Front Ribs, 24 Circuits
2.54mm (.100) Pitch SL Crimp Housing, Single Row, Version C, Front Ribs, 24 Circuits
|
Molex Electronics Ltd.
|
| 50-57-9220 0050579220 |
2.54mm (.100") Pitch SL Crimp Housing, Single Row, Version C, Front Ribs, 20 Circuits
2.54mm (.100) Pitch SL Crimp Housing, Single Row, Version C, Front Ribs, 20 Circuits
|
Molex Electronics Ltd.
|
| 50-57-9203 |
2.54mm (.100") Pitch SL Crimp Housing, Single Row, Version C, Front Ribs, 3 Circuits
2.54mm (.100) Pitch SL Crimp Housing, Single Row, Version C, Front Ribs, 3 Circuits
|
Molex Electronics Ltd.
|
| 50-57-9208 700660077 |
2.54mm (.100) Pitch SL?/a> Crimp Housing, Single Row, Version C, Front Ribs, 8 Circuits
|
Molex Electronics Ltd.
|
| T7024-TRS T7024 T7024-PGP T7024-PGQ T7024-TRQ |
The T7024 is a monolithic SiGe transmit/receive front-end IC with power amplifier, low-noise amplifier and T/R switch driver. It is especially designed for operation in TDMA systems like Bluetooth and WDCT.
BluetoothISM 2.4-GHz Front- End IC
Bluetooth?ISM 2.4-GHz Front- End IC
Bluetooth⑩/ISM 2.4-GHz Front- End IC
Bluetooth/ISM 2.4-GHz Front- End IC
|
Atmel Corp.
ATMEL[ATMEL Corporation]
|
|
