| PART |
Description |
Maker |
| IE-178054-NS-EM1 |
178K series in-circuit emulator emulation board
|
NEC
|
| IE-78K0-NS-A |
78K/0 series in-circuit emulator(with performance board)
|
NEC
|
| IE-789418-NS-EM1 |
78K/0S series in-circuit emulator emulation board
|
NEC
|
| T70L5D131-12 T70L5D131-24 |
(T70 Series) 10 Amp Printed Circuit Board Relay
|
Siemens
|
| 74026-6110 0740266110 |
2.00mm (.079) Pitch VHDM? Board-to-Board Daughtercard Receptacle, Right Angle,6-Row, 2 Blade Power Module, 1 Circuit
|
Molex Electronics Ltd.
|
| 74026-6420 0740266420 |
2.00mm (.079) Pitch VHDM? Board-to-Board Daughtercard Receptacle, Right Angle6-Row, 2 Blade Power Module, 1 Circuit
|
Molex Electronics Ltd.
|
| SE-17010 |
SE board for UPD1700X series
SYSTEM EVALUATION BOARD
|
NEC[NEC]
|
| 0751942502 75194-2502 |
2.00mm (.079) Pitch VHDM Lite-Series, Board-to-Board Backplane Header, Vertical, 6-Row
MOLEX Connector
|
Molex Electronics Ltd.
|
| SSCSNBN001BDAA3 |
TruStability? HSC Series and SSC Series Board Mount Pressure Sensors, Analog Output
|
Honeywell Solid State Electronics Center
|
| FH25-51S-0.3SH FH25-21S-0.3SH FH25-27S-0.3SH FH25- |
0.3 mm Contact Pitch/ 0.9 mm above the board/ Flexible Printed Circuit ZIF Connectors.
MS3108A16-11S
0.3 mm Contact Pitch, 0.9 mm above the board, Flexible Printed Circuit ZIF Connectors. 联系间距0.3毫米0.9以上的电路板，柔性线路板中频连接毫米
|
http://
HIROSE[Hirose Electric]
Hirose Electric USA, INC.
HIROSE ELECTRIC Co., Ltd.
|
| 76134-9002 |
VHDM? H-Series Board-to-Board Backplane Header, 2.00mm (.079) Pitch Vertical, 8-Row, Open Signal Module, 80 Circuits, Advance Mate Shield
|
Molex Electronics Ltd.
|
| STM32L152D-EVAL |
Evaluation board for STM32L1 series - with STM32L152ZD MCU
STM32L152D-EVAL evaluation board
|
ST Microelectronics
STMicroelectronics
|
