| PART |
Description |
Maker |
| M381L6423DTM-CCC/C4 M381L3223DTM-CCC/C4 M368L6423D |
184pin Unbuffered Module based on 256Mb D-die 64/72-bit Non ECC/ECC 184pin缓冲模块56MbD为基础的非ECC的模4/72-bit / ECC
|
Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
|
| SGN02G72F1BQ1SA SGN02G72F1BQ1SA-CCRT SGN02G72F1BQ1 |
204 Pin ECC SO-DIMM
|
Swissbit
|
| VL-MM7-2SBN |
2GB 256Mx64 DDR3 SDRAM NON-ECC UNBUFFERED SODIMM 204-PIN
|
List of Unclassifed Manufacturers
|
| 10-08-1043 AE-3003-4C 0010081043 |
5.08mm (.200) Pitch KK? Header, Vertical, Round Pin, 4 Circuits, Tin (Sn) Plating, Pin Length 30.48mm (1.200)
5.08mm (.200") Pitch KK庐 Header, Vertical, Round Pin, 4 Circuits, Tin (Sn) Plating, Pin Length 30.48mm (1.200")
5.08mm (.200") Pitch KK垄莽 Header, Vertical, Round Pin, 4 Circuits, Tin (Sn) Plating, Pin Length 30.48mm (1.200")
|
Molex Electronics Ltd.
|
| M381L6523BUM-LCC M368L2923BTM-CCC M368L2923BTM-LCC |
DDR SDRAM Unbuffered Module 184pin Unbuffered Module based on 512Mb B-die with 64/72-bit Non ECC/ECC 66 TSOP-II
|
SAMSUNG[Samsung semiconductor]
|
| M378T6553CZ3-CCC M378T6553CZ3-CD5 M378T6553CZ3-CE6 |
DDR2 Unbuffered SDRAM MODULE 240pin Unbuffered Module based on 512Mb C-die 64/72-bit Non-ECC/ECC
|
SAMSUNG[Samsung semiconductor]
|
| BAR64-02L BAR64-02V BAR64-04T BAR64 BAR64-04 BAR64 |
PIN Diodes - RF Switch (High isolation) in ultra-small SC79 Package
PIN Diodes - Diode for RX/TX Switches
PIN Diodes - PIN Diode for RF switches (high isolation)
RESISTOR; THK FILM CHIP, 500/200/500PPM/C UP TO 10/1M/10M CR1206 120 OHM
Silicon PIN Diode 硅PIN二极
|
Infineon Technologies A...
INFINEON[Infineon Technologies AG]
|
| HYS72V32220GU-8-C2 HYS64V16300GU HYS64V16300GU-7.5 |
SDRAM Modules - 256MB PC133 (2-2-2) 2-bank End-of-Life
SDRAM Modules - 256MB PC133 (2-2-2) 2-bank (ECC) End-of-Life
SDRAM Modules - 128MB PC133 (2-2-2) 1-bank (ECC) End-of-Life
SDRAM Modules - 128MB PC133 (2-2-2) 1-bank End-of-Life
SDRAM Modules - 256MB PC133 (3-3-3) 2-bank (ECC) End-of-Life
SDRAM Modules - 128MB PC133 (3-3-3) 1-bank (ECC) End-of-Life
SDRAM Modules - 256MB PC133 (3-3-3) 2-bank End-of-Life
SDRAM Modules - 128MB PC133 (3-3-3) 1-bank End-of-Life
3.3 V 16M x 64/72-Bit 1 Bank 128MByte SDRAM Module 3.3 V 32M x 64/72-Bit 2 Bank 256MByte SDRAM Module 168-Pin Unbuffered DIMM Modules
|
INFINEON[Infineon Technologies AG]
|
| 10-08-1021 AE-3003-2A 0010081021 0010-08-1032 AE-3 |
5.08mm (.200") Pitch KK垄莽 Header, Vertical, Round Pin, 2 Circuits, Tin (Sn) Plating, Pin Length 19.05mm (.750")
5.08mm (.200") Pitch KK庐 Header, Vertical, Round Pin, 2 Circuits, Tin (Sn) Plating, Pin Length 19.05mm (.750")
5.08mm (.200) Pitch KK? Header, Vertical, Round Pin, 2 Circuits, Tin (Sn) Plating, Pin Length 19.05mm (.750)
|
Molex Electronics Ltd.
|
| 74061-2502 0740612502 |
2.00mm (.079") Pitch VHDM庐 Board-to-Board Backplane Header, Vertical, 8-Row, Guide Pin Signal Module, Pin End Version, 200 Circuits, Pin Length 6.25mm (.246")
2.00mm (.079) Pitch VHDM? Board-to-Board Backplane Header, Vertical, 8-Row, Guide Pin Signal Module, Pin End Version, 200 Circuits, Pin Length 6.25mm (.246)
|
Molex Electronics Ltd.
|
| 74061-2511 0740612511 |
2.00mm (.079) Pitch VHDM? Board-to-Board Backplane Header, Vertical, 8-Row,Guide Pin Signal Module, Pin End Version, 200 Circuits, Pin Length 4.75mm (.187)
2.00mm (.079") Pitch VHDM垄莽 Board-to-Board Backplane Header, Vertical, 8-Row,Guide Pin Signal Module, Pin End Version, 200 Circuits, Pin Length 4.75mm (.187")
|
Molex Electronics Ltd.
|
| AE-3003-12AG 0010451121 10-45-1121 |
5.08mm (.200) Pitch KK? Header, Vertical, Round Pin, 12 Circuits, Gold (Au) Plating, Pin Length 19.05mm (.750)
5.08mm (.200") Pitch KK庐 Header, Vertical, Round Pin, 12 Circuits, Gold (Au) Plating, Pin Length 19.05mm (.750")
|
Molex Electronics Ltd.
|
