| PART |
Description |
Maker |
| 08-50-0113 |
Crimp Socket Contact; Wire Size (AWG):30-22; Contact Plating:Tin; Series:2759; Lead Pitch:2.54mm; Reel Quantity:10000; Voltage Rating:250V BRASS, TIN OVER NICKEL FINISH, WIRE TERMINAL
|
Molex, Inc.
|
| 0002066118 1560 02-06-6118 |
1.57mm (.062) Diameter, Standard .062 Pin and Socket Crimp Terminal, Series 1560,Male, with Selective Gold (Au) Plated Brass Contact, Tin/Lead Plated Crimp Area,18-24 AWG, Reel
1.57mm (.062") Diameter, Standard .062" Pin and Socket Crimp Terminal, Series 1560,Male, with Selective Gold (Au) Plated Brass Contact, Tin/Lead Plated Crimp Ar
MOLEX Connector
|
Molex Electronics Ltd.
|
| PTYFR3502-3506 PTYFR3504 PTYFR3506 |
35.0 Amp Y-LEAD TIN CAN AUTO DIODE
35.0 Amp Y-LEAD TIN CAN AUTO DIODE High surge current capability
|
FCI connector
First Components International
First Components Intern...
|
| LD08PC753KAB3A LD08PC753KAB1A LD05-20 LD20 LD13 LD |
CAPACITOR, CERAMIC, MULTILAYER, 250 V, X7R, 0.075 uF, SURFACE MOUNT, 1808 CHIP
Tip & Ring Tin/Lead Termination “B Multilayer Ceramic Chip Capacitors
Tip & Ring Tin/Lead Termination “B?Multilayer Ceramic Chip Capacitors
Tip & Ring Tin/Lead Termination “B?Multilayer Ceramic Chip Capacitors
|
AVX, Corp.
AVX Corporation
|
| SQP200 SQP20A SQP700 SQP SQP10A SQP300 SQP500 SQP1 |
AXIAL LEAD TYPE Standard TypeSQP Series, Non-Inductive TypeNSP Series
|
List of Unclassifed Manufacturers
ETC[ETC]
|
| 87914-3616 0879143616 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 36 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 36 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, 36 Circuits, 2.50楼矛m (98.4楼矛) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
|
Molex Electronics Ltd.
|
| 3601-1-07-01-00-00-08-0 |
BRASS, TIN LEAD FINISH, PCB TERMINAL
|
MILL-MAX MFG CORP
|
| 2102-5-00-50-7 2113-1-00-1-7 |
BRASS, TIN LEAD FINISH, PCB TERMINAL
|
MILL-MAX MFG CORP
|
| 1109-0-15-15-30-02-04-0 0134-0-15-15-30-02-04-0 01 |
BERYLLIUM COPPER, TIN LEAD (100) OVER NICKEL FINISH, PCB TERMINAL
BERYLLIUM COPPER ALLOY, TIN LEAD FINISH, PCB TERMINAL
BERYLLIUM COPPER ALLOY, TIN (100) OVER NICKEL FINISH, PCB TERMINAL
BERYLLIUM COPPER, MATTE TIN (200) OVER NICKEL FINISH, PCB TERMINAL
|
MILL-MAX MFG CORP
|
| 87891-4006 |
2.54mm (.100) Pitch KK庐 Header, Through Hole, Breakaway, Vertical, 40 Circuits, 2.50渭m (100渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch KK? Header, Through Hole, Breakaway, Vertical, 40 Circuits, 2.50μm (100μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
|
Molex Electronics Ltd.
|
| 87891-0306 |
2.54mm (.100) Pitch KK庐 Header, Through Hole, Breakaway, Vertical, 3 Circuits, 2.50渭m (100渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch KK? Header, Through Hole, Breakaway, Vertical, 3 Circuits, 2.50μm (100μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
|
Molex Electronics Ltd.
|
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