| PART |
Description |
Maker |
| 0002066118 1560 02-06-6118 |
1.57mm (.062) Diameter, Standard .062 Pin and Socket Crimp Terminal, Series 1560,Male, with Selective Gold (Au) Plated Brass Contact, Tin/Lead Plated Crimp Area,18-24 AWG, Reel
1.57mm (.062") Diameter, Standard .062" Pin and Socket Crimp Terminal, Series 1560,Male, with Selective Gold (Au) Plated Brass Contact, Tin/Lead Plated Crimp Ar
MOLEX Connector
|
Molex Electronics Ltd.
|
| FA24C0G2W272JNU06 |
MLCC with Dipped Radial Lead
|
TDK Electronics
|
| FA26C0G2J222JNU00 |
MLCC with Dipped Radial Lead
|
TDK Electronics
|
| PTYFR2502-2506 PTYFR2504 |
25.0 Amp Y-LEAD TIN CAN AUTO DIODE
25.0 Amp Y-LEAD TIN CAN AUTO DIODE High surge current capability
|
FCI connector
First Components Intern...
|
| 87914-3616 0879143616 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 36 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 36 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, 36 Circuits, 2.50楼矛m (98.4楼矛) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
|
Molex Electronics Ltd.
|
| MYX29GL01GS11DPIV2 |
Tin-lead ball metallurgy
|
Micross Components
|
| S600-06 |
Cup/Bobbin Termnal, reeled, tin/lead
|
HARWIN INC
|
| 8955-0-05-1-3 8600-2-05-1-3 |
BRASS, TIN LEAD FINISH, PCB TERMINAL
|
MILL-MAX MFG CORP
|
| 87891-4006 |
2.54mm (.100) Pitch KK庐 Header, Through Hole, Breakaway, Vertical, 40 Circuits, 2.50渭m (100渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch KK? Header, Through Hole, Breakaway, Vertical, 40 Circuits, 2.50μm (100μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
|
Molex Electronics Ltd.
|
| 87891-0306 |
2.54mm (.100) Pitch KK庐 Header, Through Hole, Breakaway, Vertical, 3 Circuits, 2.50渭m (100渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch KK? Header, Through Hole, Breakaway, Vertical, 3 Circuits, 2.50μm (100μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
|
Molex Electronics Ltd.
|
|
