| PART |
Description |
Maker |
| 82547EI |
Dual Footprint
|
Intel Corporation
|
| 82547GI |
Dual Footprint
|
Intel Corporation
|
| KI5935DC |
TrenchFET Power MOSFETS Low rDS(on) Dual and Excellent Power Handling In A Compact Footprint
|
TY Semiconductor Co., Ltd
|
| MBC120-1012L MBC120-1024L MBC120-1030L MBC120-1015 |
3 x 2 Footprint
|
Bel Fuse Inc.
|
| MA4E2513L-1289W MA4E2513 MA4E2513-1289 MA4E2513L-1 |
SURMOUNT Low Barrier Tee ?301 Footprint Silicon Schottky Diodes
SURMOUNT Low Barrier Tee “0301” Footprint Silicon Schottky Diodes
|
MACOM[Tyco Electronics]
|
| 22-43-8130 A-42267-13A |
2.50mm (.098) Pitch SPOX Header, Shrouded, In-line Footprint, 13 Circuits, White
2.50mm (.098") Pitch SPOX垄芒 Header, Shrouded, In-line Footprint, 13 Circuits, White
|
Molex Electronics Ltd.
|
| R-2R |
QSOP Package - Small Footprint
|
TT Electronics.
|
| AP2605GY0-HF-16 |
Small Footprint & Low Profile Package
|
Advanced Power Electron...
|
| KP3812W00A16 |
Small Footprint Surface Mount Package
|
KODENSHI KOREA CORP.
|
| KP3528BSKA2I-JX |
Small Footprint Surface Mount Package
|
KODENSHI KOREA CORP.
|
| ECS-200-20-23BEL-TR ECS-200-S-23BEL-TR |
The ECX-64 is a miniature SMD Crystal with a 6 x 3.5 mm 4 pad footprint
|
ECS, Inc.
|
