| PART |
Description |
Maker |
| BCR20B BCR20E BCR20A BCR20C |
MEDIUM POWER USE A, B, C : NON-INSULATED TYPE, E : INSULATED TYPE, GLASS PASSIVATION TYPE
|
Mitsubishi Electric Semiconductor
|
| PS11011 |
Application Specific Intelligent Power Module FLAT-BASE TYPE INSULATED PACKAGE
FLAT-BASE TYPE INSULATED TYPE
|
Mitsubishi Electric Semiconductor
POWEREX[Powerex Power Semiconductors]
|
| SM130G0 SM145G0 SM SM095G0 SM110G0 |
FUSIBLE ALLOY THERMAL SENSITIVE TYPE, 0.5 AMPERES (250 Va.c.) and 3 and 5 AMPERES (50 Vd.c.) Rated Current
FUSIBLE ALLOY THERMAL SENSITIVE TYPE 0.5 AMPERES 250 Va.c. and 3 and 5 AMPERES 50 Vd.c. Rated Current
FUSIBLE ALLOY THERMAL SENSITIVE TYPE/ 0.5 AMPERES 250 Va.c. and 3 and 5 AMPERES 50 Vd.c. Rated Current
FUSIBLE ALLOY THERMAL SENSITIVE TYPE, 0.5 AMPERES 250 Va.c. and 3 and 5 AMPERES 50 Vd.c. Rated Current 易熔合金热敏感型.5安培250 Va.c.日和5安培50 Vd.c.额定电流
|
NEC[NEC]
NEC, Corp.
|
| PM200CSE060 |
FLAT-BASE TYPE INSULATED INSULATED PACKAGE 平性基地型绝缘绝缘包装
FLAT-BASE TYPE INSULATED PACKAGE
|
Mitsubishi Electric, Corp.
MITSUBISHI[Mitsubishi Electric Semiconductor]
|
| BCR5AM |
MITSUBISHI SEMICONDUCTOR (TRIAC) MEDIUM POWER USE NON-INSULATED TYPE, PLANAR PASSIVATION TYPE
|
Mitsubishi Electric Corporation
|
| BCR12KM-14 |
MITSUBISHI SEMICONDUCTOR (TRIAC) MEDIUM POWER USE INSULATED TYPE, PLANAR PASSIVATION TYPE
|
Mitsubishi Electric Corporation
|
| BCR16UM |
MITSUBISHI SEMICONDUCTOR (TRIAC) MEDIUM POWER USE INSULATED TYPE, GLASS PASSIVATION TYPE
|
Mitsubishi Electric Corporation
|
| BCR8CS |
MITSUBISHI SEMICONDUCTOR (TRIAC) MEDIUM POWER USE NON-INSULATED TYPE, PLANAR PASSIVATION TYPE
|
Mitsubishi Electric Corporation
|
| BCR12CS |
MITSUBISHI SEMICONDUCTOR (TRIAC) MEDIUM POWER USE NON-INSULATED TYPE, PLANAR PASSIVATION TYPE
|
Mitsubishi Electric Corporation
|
