| PART |
Description |
Maker |
| C3225X7S2A335KT |
SPECIFICATION FOR TDK MULTILAYER CERAMIC CHIP CAPACITORS
|
TDK Electronics
|
| CAK-001 CAK-001MF CAK-001AF CAK-2405F CAK-002AF CA |
TDK DC to DC Converters, DC to AC inverters
|
TDK[TDK Electronics]
|
| C1005X5R0J475K C3225X7S1H106M |
TDK MLCC Capacitance Offering
|
TDK Electronics
|
| GLF2012T220K GLF251812T220M GLC2518T101K GLF2518T1 |
GLF,GLC Series
TDK’s New Winding Type Chip Inductor
|
TDK Electronics
|
| 55A0812 |
This specification sheet forms a part of the latest issue of Raychem Specification 55A.
|
TE Connectivity Ltd
|
| 55PC1246 |
This specification sheet forms a part of the latest issue of Raychem Specification 55PC.
|
Tyco Electronics
|
| 55PC1131 |
This specification sheet forms a part of the latest issue of Raychem Specification 55PC.
|
Tyco Electronics
|
| 55PC1223 |
This specification sheet forms a part of the latest issue of Raychem Specification 55PC.
|
Tyco Electronics
|
| 55PC1811 |
This specification sheet forms a part of the latest issue of Raychem Specification 55PC.
|
TE Connectivity Ltd
|
| 749010013 744761068A |
All 16 terminals must lie on a plane within 004 of surface A after lead tinning
specification for release
specification for release
|
Wurth Elektronik GmbH & Co. KG, Germany.
Wurth Elektronik GmbH &...
|
| CMLT6427E |
ENHANCED SPECIFICATION SURFACE MOUNT, PICOmini SILICON NPN DARLINGTON TRANSISTOR
From old datasheet system
an Enhanced Specification, PICOmini™, NPN Silicon
|
CENTRAL[Central Semiconductor Corp]
Central Semiconductor Corporation
|
| MPC8240RZUPND MPC8240RZUPNS |
MPC8240 Part Number Specification for the XPC8240RZUnnnx Series
Part Number Specification for the XPC8240RZUnnnx Series
|
Motorola
|
