PART |
Description |
Maker |
90-0092 |
PACKAGE LAND PATTERN, (U8) UMAX 8 LEAD
|
Maxim Integrated Products
|
SOD523 |
Surface mounted, 2 pin package Package outline
|
Zetex Semiconductors
|
AP2311GN-HF AP2311GN-HF-14 |
1.8 A, 60 V, 0.25 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3 Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp. Advanced Power Electronics Corp. Advanced Power Electronics ...
|
SOT27-1 |
Package outline
|
NXP Semiconductors PHILIPS[Philips Semiconductors]
|
SOT527-1 |
Package outline
|
NXP Semiconductors PHILIPS[Philips Semiconductors]
|
SOP-8-EP |
Package Outline
|
Global Mixed-mode Techn...
|
TQFN3.8X6.2-44 |
Package Outline
|
Global Mixed-mode Techn...
|
TQFN3X4-20 |
Package Outline
|
Global Mixed-mode Techn...
|
SC70-5 |
Package Outline
|
Global Mixed-mode Techn...
|
TQFN4X4-28 |
Package Outline
|
Global Mixed-mode Techn...
|