| PART |
Description |
Maker |
| 21-0041 |
PACKAGE OUTLINE, 8L, 14L, 16L SOIC, 150INCH
|
Maxim Integrated Products
|
| BIR-BO13J4G |
5 mm, 1 ELEMENT, INFRARED LED, 850 nm ROHS COMPLIANT PACKAGE-2
END-LOOK PACKAGE LIGHT EMITTING DIODE
17 Bit System Integrating A/D Processor, 16L SOIC 完式组件发光二极
|
American Bright Optoelectronics, Corp.
Bright LED Electronics Corp.
Bright LED Electronics, Corp.
|
| SC70-5 |
Surface mounted, 5 pin package Package outline
|
ZETEX[Zetex Semiconductors]
|
| AP2317GN-HF |
4.2 A, 20 V, 0.052 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp.
Advanced Power Electronics Corp.
|
| BL-HA134A-TRB |
Quad N-Channel EPAD Matched Pair MOSFET Array, Vgs= 0.4 V, 16L PDIP, EPAD Enabled
Amber Mono-color type 3.2x1.0x2.0mm (1204) standard package.
|
Bright LED Electronics Corp.
|
| TO220TF |
Package Outline
|
Global Mixed-mode Techn...
|
| SOT684-2 |
Package outline
|
NXP Semiconductors
PHILIPS[Philips Semiconductors]
|
| TSOT23-6 |
Package Outline
|
Global Mixed-mode Techn...
|
| TO252 |
Package Outline
|
Global Mixed-mode Techn...
|
| TO252-5 |
Package Outline
|
Global Mixed-mode Techn...
|
| TQFN3.5X3.5-20 |
Package Outline
|
Global Mixed-mode Techn...
|
| SSOP-16 |
Package Outline
|
Global Mixed-mode Techn...
|
