| PART |
Description |
Maker |
| 21-0076 |
PACKAGE OUTLINE, 5L SC70
|
Maxim Integrated Products
|
| ADM6384YKS26D3Z-R7 ADM6384YKS23D3Z-R7 |
Microprocessor Supervisory Circuit in 4-Lead SC70; Package: SC70; No of Pins: 4; Temperature Range: Automotive 1-CHANNEL POWER SUPPLY SUPPORT CKT, PDSO4
|
Analog Devices, Inc.
|
| ICS280PGLF ICS280 ICS280PG ICS280PGILF ICS280PGI |
From old datasheet system
Package Outline and Package Dimensions (16-pin TSSOP,173 Mil. Body) 封装和封装尺寸（16引脚TSSOP封装173军医。体
|
Integrated Circuit Solu...
ICSI[Integrated Circuit Solution Inc]
Intersil, Corp.
|
| SC70-6 |
Surface mounted / 5 pin package Package outline
|
Zetex Semiconductors
|
| AP2301BGN-HF AP2301BGN-HF-14 |
2.8 A, 20 V, 0.13 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp.
Advanced Power Electronics Corp.
Advanced Power Electron...
|
| WDFN2X2-8 |
Package Outline
|
Global Mixed-mode Techn...
|
| SC70-5 |
Package Outline
|
Global Mixed-mode Techn...
|
| TQFN3X3-20 |
Package Outline
|
Global Mixed-mode Techn...
|
| SOT109-1 |
Package outline
|
NXP Semiconductors
Philips Semiconductors
|
| SOT223-6 |
Package Outline
|
Global Mixed-mode Techn...
|
