PART |
Description |
Maker |
90-0175 |
PACKAGE LAND PATTERN, (U6) 6L SOT
|
Maxim Integrated Products
|
90-0028 |
PACKAGE LAND PATTERN (T2855-8 / T2855 8 / T2855MK 8)
|
Maxim Integrated Products
|
C1206C104C2RAC C0603C103Z5VAC C1206C103Z3VAC C1206 |
Fast Sample-and-Hold Circuit; Package: Land Pattern: Not Available; Temperature: 0°C to 70°C CERAMIC CHIP/STANDARD 陶瓷芯片/标准
|
KEMET Corporation
|
90-0150 |
PACKAGE LAND PATTERN, (S8E-12 / S8E 12)
|
Maxim Integrated Products
|
90-0121 |
PACKAGE LAND PATTERN, (T1655-4 / T1655 4)
|
Maxim Integrated Products
|
90-0058 |
PACKAGE LAND PATTERN, (T633-2 / T633 2)
|
Maxim Integrated Products
|
90-0082 |
PACKAGE LAND PATTERN, (T1032N-1 / T1032N 1)
|
Maxim Integrated Products
|
90-0119 |
PACKAGE LAND PATTERN, (U14E-3 / U14E 3)
|
Maxim Integrated Products
|
LPN1040T-330K LPN1040T-470K LPN1040T-471K LPN1040T |
Shape & Dimensions / Recommended Solder Land Pattern
|
ABCO ELECTRONICS CO.LTD
|
LPF7032T-3R3M LPF7032T-100M LPF7032T-101M |
Shape & Dimensions / Recommended Solder Land Pattern
|
ABCO ELECTRONICS CO.LTD
|