| PART |
Description |
Maker |
| K4S56163LC-RFR |
4M x 16Bit x 4 Banks Mobile SDRAM in 54CSP Data Sheet
|
Samsung Electronic
|
| 2-796644-0 1-796644-0 3-796644-0 C-796644 |
TERMI BLOK HEADER ASSEMBLY, STRAIGHT, CLOSED ENDS, 3.5mm PITCH
|
Tyco Electronics
|
| 2-1546111-0 1-1546111-0 |
TERMI-BLOK HEADER ASSEMBLY, 180 DEGREE, CLOSED ENDS, 5.08mm PITCH
|
Tyco Electronics
|
| 1-796643-0 2-796643-0 C-796643 |
TERMI-BLOK HEADER ASSEMBLY, 180 DEGREE, CLOSED ENDS, 5.00mm PITCH
|
Tyco Electronics
|
| UPD46128953F1-EB1 UPD46128953-X UPD46128953-E15X U |
128M-BIT CMOS MOBILE SPECIFIED RAM 4M-WORD BY 32-BIT ADDRESS / DATA MULTIPLEXED EXTENDED TEMPERATURE OPERATION
|
NEC
|
| MF1117V-2 |
From old datasheet system
FOR DIGITAL MOBILE TELEPHONE Rx
FOR DIGITAL MOBILE TELEPHONE, Rx
FOR DIGITAL MOBILE TELEPHONE / Rx
GIGATRUE 550 CAT6 PINK STRANDED BULK 250FT
|
MITSUBISHI[Mitsubishi Electric Semiconductor]
Mitsubishi Electric Corporation
|
| DVS-355-ZU25E DVS-355-MU25E DVS-355-SU25E DVS-355M |
Embedded/Mobile Digital Video Platform with Intel Core Duo Mobile Processor
|
Advantech Co., Ltd.
|
| HYB18L512160BF-7.5 HYE18L512160BF-7.5 |
DRAMs for Mobile Applications 512-Mbit Mobile-RAM
|
http://
|
| HYE18L128160BF-7.5 |
DRAMs for Mobile Applications 128-Mbit Mobile-RAM
|
http://
|
| HYB18L256160BC-7.5 HYB18L256160BF-7.5 HYB18L256160 |
DRAMs for Mobile Applications 256-Mbit Mobile-RAM
|
Qimonda AG
http://
|
