PART |
Description |
Maker |
IBM13M32734BCA |
32M x 72 2-Bank Registered SDRAM Module(32M x 72 2组寄存同步动态RAM模块) 32M × 72配置2,银行注册内存模块(32M × 72配置2组寄存同步动态内存模块)
|
International Business Machines, Corp.
|
HYS64V32300GU HYS72V32300GU |
3.3 V 32M × 64-Bit SDRAM Module(3.3 V 32M × 64同步动态RAM模块) 3.3 V 32M × 72-Bit SDRAM Module(3.3 V 32M × 72同步动态RAM模块)
|
SIEMENS AG
|
HI-7151 HI1-7151S-2 HI1-7151T-2 HI3-7151K-5 HI3-71 |
10-Bit, High Speed, A/D Converter with Track and Hold 1-CH 10-BIT FLASH METHOD ADC, PARALLEL ACCESS, PDIP40 128 MACROCELL 3.3 VOLT ISP CPLD STORAGE, SLIDES CABINET RoHS Compliant: Yes
|
Intersil, Corp. INTERSIL[Intersil Corporation]
|
MX7535JP-T MX7537JCWG-T MX7524UQ/883B MX7533LEPE M |
Microprocessor-Compatible, 14-Bit DACs PARALLEL, WORD INPUT LOADING, 0.8 us SETTLING TIME, 14-BIT DAC, PQCC28 CMOS, Parallel Loading, Dual, 12-Bit Multiplying DAC DUAL, PARALLEL, WORD INPUT LOADING, 0.8 us SETTLING TIME, 12-BIT DAC, PDSO24 Improved MX7524 PARALLEL, 8 BITS INPUT LOADING, 8-BIT DAC, CDIP16 CMOS, Low-Cost, 10-Bit Multiplying D/A Converter PARALLEL, WORD INPUT LOADING, 10-BIT DAC, PQCC20 PARALLEL, WORD INPUT LOADING, 0.8 us SETTLING TIME, 14-BIT DAC, UUC27
|
Maxim Integrated Products, Inc. MAXIM INTEGRATED PRODUCTS INC
|
S70WS512N00BFWA23 S70WS512N00BAWAB3 S70WS512N00BAW |
Same-Die Stacked Multi-Chip Product (MCP) 512 Megabit (32M x 16 bit) CMOS 1.8 Volt-only Simultaneous Read/Write, Burst-mode Flash Memory 同硅晶片堆叠多芯片产品(MCP)的512兆位2兆16位)的CMOS 1.8伏,只有同时写,突发模式闪存
|
Spansion Inc. Spansion, Inc.
|
V436632R24VXTG-75PCL V436632R24VL V436632R24VXTG-1 |
3.3 VOLT 32M x 64 LOW PROFILE UNBUFFERED SDRAM MODULE
|
Mosel Vitelic, Corp. MOSEL[Mosel Vitelic, Corp] Mosel Vitelic Corp
|
AT45DB321D-MU-SL955 AT45DB321D-MWU-SL955 AT45DB321 |
32-megabit 2.7-volt DataFlash 32M X 1 FLASH 2.7V PROM, PDSO8
|
ATMEL Corporation
|
V436532S04VATG |
3.3 VOLT 32M x 64 HIGH PERFORMANCE PC133 UNBUFFERED SDRAM MODULE
|
MOSEL[Mosel Vitelic, Corp] Mosel Vitelic Corp
|