| PART |
Description |
Maker |
| UDZSTE-175.1B |
Compact, 2-pin mini-mold type for high-density mounting. (UMD2)
|
Rohm
|
| UDZSTE-175.6B |
Compact, 2-pin mini-mold type for high-density mounting. (UMD2)
|
Rohm
|
| KF3004-GD31A |
Compact high speed thick film thermal printhead (12 dots / mm)
|
Rohm
|
| PC417 |
Compact/ Surface Mount Ultra-high Speed Response OPIC Photocoupler
Compact, Surface Mount Ultra-high Speed Response OPIC Photocoupler
|
Sharp Electrionic Components
|
| PC410 |
Compact, Surface Mount Ultra-high Speed Response OPIC Photocoupler
|
Sharp Electrionic Components
|
| CPM2CS100C |
CPM2C-S10C offers high-speed local control, remote expandability in a very compact package.
|
Omron Electronics LLC
|
| HCPL-901J HCPL-900J HCPL-9031 HCPL-902J HCPL-9030 |
SPECIAL
HCPL-0931 · High Speed Digital Isolator
HCPL-0930 · High Speed Digital Isolator
HCPL-092J · High Speed Digital Isolator
HCPL-091J · High Speed Digital Isolator
HCPL-090J · High Speed Digital Isolator
HCPL-0900 · High Speed Digital Isolator
HCPL-9000 · High Speed Digital Isolator
HCPL-9030 · High Speed Digital Isolator
HCPL-902J · High Speed Digital Isolator
HCPL-9031 · High Speed Digital Isolator
HCPL-900J · High Speed Digital Isolator
HCPL-901J · High Speed Digital Isolator
|
Agilent (Hewlett-Packard)
|
| UA2-3NJ-L UA2-3SNJ-L UB2-3NJ-L UB2-3SNJ-L UA2-3NJ- |
Super-compact size, Slim-package, Surface mounting type
|
NEC
|
| UA2 |
Super-compact size/ Slim-package/ Surface mounting type
|
NEC
|
| SIL855160 |
AC Semiconductor Contactor pitch 22,5mm compact size and DIN rail mounting.
|
celduc-relais
|
| SIL842970 |
AC Semiconductor Contactor pitch 22,5mm compact size and DIN rail mounting.
|
http://
celduc-relais
|
