
	Part Number	Hot Search : MMSZ5229 E007236 5KP54 HBL4K ET100 BF720 TDA72 M6244
	Product Description
	Full Text Search

21-0137 - PACKAGE OUTLINE, 6,8,10 & 14L, TDFN, EXPOSED PAD, 330.80MM

21-0137_5888527.PDF Datasheet

Part No.

21-0137

Description

PACKAGE OUTLINE, 6,8,10 & 14L, TDFN, EXPOSED PAD, 3*3*0.80MM

File Size

42.39K / 2 Page

Maker

Maxim Integrated Products

JITONG TECHNOLOGY
(CHINA HK & SZ)
Datasheet.hk's Sponsor

Part: 21-37439-03

Maker: N/A

Pack: QFP-10..

Stock: 57

Unit price for :

50: $12.92

100: $12.28

1000: $11.63

Email: oulindz@gmail.com

Homepage

http://www.maxim-ic.com

Download

[ 21-0137 Datasheet PDF Downlaod from IC-ON-LINE.CN

] :-)

Full text search : PACKAGE OUTLINE, 6,8,10 & 14L, TDFN, EXPOSED PAD, 3*3*0.80MM

Related Part Number

PART	Description	Maker
TO263	Package Outline Drawing Transistor Outline 封装外形图晶体管外形	Electronic Theatre Controls, Inc. ETC List of Unclassifed Manufacturers
MDP0040	PACKAGE OUTLINE DRAWING QSOP - 0.150 NARROW BODY PACKAGE	Elantec Semiconductor
SC70-6	Surface mounted / 5 pin package Package outline	Zetex Semiconductors
TSSOP-38	Package Outline	Global Mixed-mode Techn...
TDFN1.6X1.6-6	Package Outline	Global Mixed-mode Techn...
TDFN3X3-6	Package Outline	Global Mixed-mode Techn...
SOT684-2	Package outline	NXP Semiconductors PHILIPS[Philips Semiconductors]
PG-LQFP-64-13 PG-LQFP-64-5 PG-LQFP-64-4	Package Outline	Infineon
TQFN7X7-44	Package Outline	Global Mixed-mode Techn...
TDFN3X4-12	Package Outline	Global Mixed-mode Techn...

Related keyword From Full Text Search System

21-0137 参数封装	21-0137 bookmark	21-0137 Purpose	21-0137 Ic on line	21-0137 interrupt
21-0137 cost	21-0137 DATASHEET PDF	21-0137 Logic	21-0137 cmos	21-0137 Serie

21-0137 - PACKAGE OUTLINE, 6,8,10 & 14L, TDFN, EXPOSED PAD, 3*3*0.80MM