| PART |
Description |
Maker |
| IL3S-HJ9F18-20.000 IL3S-JH9F18-20.000 IL3S-BI9F18- |
4 Pad Plastic Package Quartz Crystal, 4.6 mm x 12.5 mm
4 Pad Plastic Package Quartz Crystal, 4.6 mm x 12.5 mm
|
ILSI America LLC
|
| IL3X-HX5F12.5-32.768 |
2 Pad Ceramic Package, 1.5 mm x 3.2 mm
|
ILSI America LLC
|
| 0916580050 |
track-it, Traceability Pad, Nickel Silver with special processing, -40 to 350C, Plastic
|
Molex Electronics Ltd.
|
| IL3Y-HX5F6.0-32.768 IL3Y-HX5F12.5-32.768 |
2 Pad Glass Package Quartz Crystal, 1.5 mm x 4.1 mm
|
ILSI America LLC
|
| J20.BPACKAGE |
20 PAD CERAMIC LEADLESS CHIP CARRIER PACKAGE
|
Intersil Corporation
|
| J68.APACKAGE |
68 PAD CERAMIC LEADLESS CHIP CARRIER PACKAGE
|
Intersil Corporation
|
| ILCX03-BG3318-20.000 ILCX03-BG0F18-20.000 ILCX03-B |
2 Pad Ceramic Package Quartz Crystal, 3.2 mm x 5 mm
2 Pad Ceramic Package Quartz Crystal, 3.2 mm x 5 mm
|
ILSI America LLC
|
| AD8370AREZ |
750MHz Digitally Controlled Variable Gain Amplifier; Package: TSSOP_EP (3.0mm pad size); No of Pins: 16; Temperature Range: Industrial
|
ANALOG DEVICES INC
|
| AD8195ACPZ |
1:1 HDMI/DVI Buffer with Equalization; Package: LFCSP (6x6mm w/4.1mm pad); No of Pins: 40; Temperature Range: Industrial SPECIALTY CONSUMER CIRCUIT, QCC40
|
Amphenol, Corp.
|
| BGA-320P-M06 |
PLASTIC BALL GRID ARRAY PACKAGE 320 PIN PLASTIC
|
Fujitsu Limited
|
| BGA-320P-M06 |
PLASTIC BALL GRID ARRAY PACKAGE 320 PIN PLASTIC
|
Fujitsu Component Limited.
FUJITSU[Fujitsu Media Devices Limited]
|
