| PART |
Description |
Maker |
| 2-1445054-3 2-1445054-4 2-1445054-2 2-1445054-5 |
RIGHT ANGLE THRU HOLE HEADER ASSY, TIN CONTACTS W/THRU HOLE HOLDDOWNS, SINGLE ROW, MICRO MATE-N-LOK
RIGHT ANGLE THRU HOLD HEADER ASSY, TIN CONTACTS W/THRU HOLE HOLDDOWNS, SINGLE ROW, MICRO MATE-N-LOK
|
Tyco Electronics
|
| 5103308-3 5103308-6 5103308-2 5103308-1 5103308-7 |
HEADER ASSY, VERTICAL, LOW PROFILE, AMP-LATCH
|
Tyco Electronics
|
| 2-1123309-2 2-1123309-3 |
DOUBLE RW HEADER ASSY 4P
DOUBLE ROW HEADER ASSY 4P(H TYPE) <DYNAMIC D-5200 D>
|
Tyco Electronics
|
| 2-1445053-2 2-1445053-9 |
VERTICAL SURFACE MOUNT HEADER ASSY TIN CONTACTS, SURF MOUNT HOLDDOWNS, SINGLE ROW, MICRO MATE-N-LOK
VERTICAL SURFACE MOUNT HEADER ASSY, TIN CONTACTS, SURF MOUNT HOLDDOWNS, SINGLE ROW, MICRO MATE-N-LOK
|
Tyco Electronics
|
| 85013-3122 0850133122 |
2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Style R Reverse, 1μm (40μ) Selective Gold (Au), 96 Circuits, Lead free
2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Style R Reverse, 1渭m (40渭) Selective Gold (Au), 96 Circuits, Lead free
2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Style R Reverse, 1楼矛m (40楼矛) Selective Gold (Au), 96 Circuits, Lead free
|
Molex Electronics Ltd.
|
| 0015800281 70567-0012 15-80-0281 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, Tin (Sn) Plating
MOLEX Connector
|
Molex Electronics Ltd.
|
| 15-80-0089 0015800089 A-70567-0274 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, 0.38渭m (15渭) Gold, (Au) Selective Plat
Molex Electronics Ltd.
|
Molex Electronics Ltd.
|
| 15-80-0083 0015800083 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plati
Molex Electronics Ltd.
|
Molex Electronics Ltd.
|
| 15-80-0063 0015800063 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plati
Molex Electronics Ltd.
|
Molex Electronics Ltd.
|
| 0877730005 87773-0005 |
3-Pin Header, Staggered, Vertical, Through Hole, Lead-free
|
Molex Electronics Ltd.
|
| 15-47-7736 0015477736 |
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 36 Circuits, 0.76渭m (30渭) Gold (Au) Selective Platin
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 36 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
|
