PART |
Description |
Maker |
M6MGD137W34DKT |
Memory>MCP(Multi Chip Package)>S-µMCP(Stacked micro MCP)
|
Renesas
|
F2223-21SH |
MCP ASSEMBLY
|
Hamamatsu Photonics
|
F4294-09 |
MCP ASSEMBLY WITH CENTER HOLE FOR REFLECTRON MS
|
Hamamatsu Photonics HAMAMATSU[Hamamatsu Corporation]
|
F6589 |
ULTRA THIN MCP ASSEMBLY WITH CENTER HOLE
|
HAMAMATSU[Hamamatsu Corporation]
|
DS42546 AM29DL163D |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM From old datasheet system MCP Flash Memory and SRAM
|
AMD[Advanced Micro Devices]
|
DS42514 |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM MCP Flash Memory and SRAM From old datasheet system
|
AMD[Advanced Micro Devices]
|
DS42585 AM29DL324D |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM MCP Flash Memory and SRAM
|
AMD[Advanced Micro Devices]
|
S71WS512ND0BAWAN3 S71WS512ND0BAWAP0 S71WS256ND0BAW |
Stacked Multi-Chip Product (MCP) Stacked Multi-Chip Product (MCP) SPECIALTY MEMORY CIRCUIT, PBGA84
|
http:// SPANSION[SPANSION] Spansion, Inc.
|
MB84VD22280FE-70 MB84VD22280FA-70 MB84VD22290FE-70 |
2-Stacked MCP
|
Fujitsu
|
MB84VD21181EM-70PBS MB84VD21183EM-70PBS MB84VD2118 |
Stacked MCP (Multi-Chip Package) FLASH MEMORY & SRAM CMOS Stacked MCP (Multi-Chip Package) FLASH MEMORY & SRAM CMOS SPECIALTY MEMORY CIRCUIT, PBGA56
|
Spansion Inc. Spansion, Inc.
|