| PART |
Description |
Maker |
| WS512K8L-20CM WS512K8L-20CQA WS512K8-XCX WS512K8-2 |
512K X 8 MULTI DEVICE SRAM MODULE, 45 ns, CDIP32
512K X 8 MULTI DEVICE SRAM MODULE, 35 ns, CDIP32
512K X 8 MULTI DEVICE SRAM MODULE, 25 ns, CDIP32
512Kx8 SRAM MODULE, SMD 5962-92078
|
WEDC[White Electronic Designs Corporation]
|
| 89C1632RPQE-25 89C1632RPQH-25 89C1632RPQK-25 89C16 |
16 Megabit (512K x 32-Bit) MCM SRAM 512K X 32 MULTI DEVICE SRAM MODULE, 25 ns, CQFP68
16 Megabit (512K x 32-Bit) MCM SRAM 512K X 32 MULTI DEVICE SRAM MODULE, 30 ns, CQFP68
16 Megabit (512K x 32-Bit) MCM SRAM 512K X 32 MULTI DEVICE SRAM MODULE, 20 ns, CQFP68
16 Megabit (512K x 32-Bit) MCM SRAM 16兆位12k × 32的位）立方米的SRAM
|
Maxwell Technologies, Inc
|
| CYM1846PM-15C CYM1846PM-20C CYM1846PZ-20C CYM1846P |
512K X 32 MULTI DEVICE SRAM MODULE, 35 ns, PSMA72 PLASTIC, SIMM-72
512K X 32 MULTI DEVICE SRAM MODULE, 15 ns, PSMA72 PLASTIC, SIMM-72
SRAM|512KX32|CMOS|SSIM|72PIN|PLASTIC
null : SRAM Modules
|
Cypress Semiconductor, Corp.
|
| CYM8301BV33-10BGC CYM8301BV33-10BGI CYM8301BV33-12 |
512K X 24 MULTI DEVICE SRAM MODULE, 12 ns, PBGA119 14 X 22 MM, 2.40 MM HEIGHT, PLASTIC, BGA-119
512K X 24 MULTI DEVICE SRAM MODULE, 10 ns, PBGA119 14 X 22 MM, 2.40 MM HEIGHT, PLASTIC, BGA-119
null : SRAM Modules
|
Cypress Semiconductor, Corp.
|
| WS128K32-25G2ME WS128K32-45G2ME |
512K X 8 MULTI DEVICE SRAM MODULE, 25 ns, CQFP68
512K X 8 MULTI DEVICE SRAM MODULE, 45 ns, CQFP68
|
WHITE ELECTRONIC DESIGNS CORP
|
| WS128K32-25HSME |
512K X 8 MULTI DEVICE SRAM MODULE, 25 ns, CPGA66
|
WHITE ELECTRONIC DESIGNS CORP
|
| WS512K16-35FLCA |
512K X 16 MULTI DEVICE SRAM MODULE, 35 ns, CDFP44
|
MICROSEMI CORP-PMG MICROELECTRONICS
|
| WS128K32NV-17H1C WS128K32NV-17H1I WS128K32NV-17H1M |
512K X 8 MULTI DEVICE SRAM MODULE, 17 ns, CHIP66
512K X 8 MULTI DEVICE SRAM MODULE, 20 ns, CHIP66
512K X 8 MULTI DEVICE SRAM MODULE, 15 ns, CHIP66
512K X 8 MULTI DEVICE SRAM MODULE, 25 ns, CHIP66
512K X 8 MULTI DEVICE SRAM MODULE, 35 ns, CHIP66
|
White Electronic Designs, Corp.
Microsemi, Corp.
|
| WS512K32NV-17G2UC |
512K X 32 MULTI DEVICE SRAM MODULE, 17 ns, CQFP68 22.4 MM, 3.56 MM HEIGHT, CERAMIC, QFP-68
|
Microsemi, Corp.
|
| CYM8301V33-10BGC CYM8301V33-12BGC |
512K X 24 MULTI DEVICE SRAM MODULE, 10 ns, BGA119 14 X 22 MM, 2.40 MM HEIGHT, BGA-119
512K X 24 MULTI DEVICE SRAM MODULE, 12 ns, BGA119 14 X 22 MM, 2.40 MM HEIGHT, BGA-119
|
Cypress Semiconductor, Corp.
|
| CY7C1372CV25-167AI CY7C1372CV25-167BGI CY7C1372CV2 |
512K x 36/1M x 18 Pipelined SRAM with NoBLArchitecture 1M X 18 ZBT SRAM, 3 ns, PQFP100
512K x 36/1M x 18 Pipelined SRAM with NoBLArchitecture 1M X 18 ZBT SRAM, 3 ns, PBGA165
512K x 36/1M x 18 Pipelined SRAM with NoBLArchitecture 1M X 18 ZBT SRAM, 3 ns, PBGA119
512K x 36/1M x 18 Pipelined SRAM with NoBLArchitecture 1M X 18 ZBT SRAM, 2.8 ns, PBGA119
512K x 36/1M x 18 Pipelined SRAM with NoBLArchitecture 1M X 18 ZBT SRAM, 2.8 ns, PBGA165
512K x 36/1M x 18 Pipelined SRAM with NoBLArchitecture 512K X 36 ZBT SRAM, 3 ns, PBGA165
512K x 36/1M x 18 Pipelined SRAM with NoBLArchitecture 512K X 36 ZBT SRAM, 3 ns, PQFP100
512K x 36/1M x 18 Pipelined SRAM with NoBLArchitecture 512K X 36 ZBT SRAM, 3.4 ns, PQFP100
512K x 36/1M x 18 Pipelined SRAM with NoBLArchitecture 512K X 36 ZBT SRAM, 3.4 ns, PBGA165
512K x 36/1M x 18 Pipelined SRAM with NoBLArchitecture 12k × 36/1M × 18流水线的SRAM架构的总线延迟
CAP,Ceramic,10000pF,500VDC,10-% Tol,10% Tol,X7R-TC Code,-15,15%-TC,30ppm-TC RoHS Compliant: Yes
512K x 36/1M x 18 Pipelined SRAM with NoBL Architecture
|
Cypress Semiconductor, Corp.
Cypress Semiconductor Corp.
|
| WPS512K32-15PJC WPS512K32-15PJI WPS512K32-17PJC WP |
512K x 8 SRAM, 15ns
512K x 8 SRAM, 17ns
512K x 8 SRAM, 20ns
512K x 8 SRAM, 25ns
|
White Electronic Designs
|
|
