| PART |
Description |
Maker |
| 1896941 1908871 1827428 1879285 1833027 |
FK-MCP 1,5/ 2-STF-3,81
|
PHOENIX CONTACT
|
| AS3SSD16GB5PBG AS3SSD16GB5PBGR_CT AS3SSD16GB5PBGR_ |
SPECIALTY MICROPROCESSOR CIRCUIT, PBGA381 31 X 31 MM, ROHS COMPLIANT PACKAGE-381
SPECIALTY MICROPROCESSOR CIRCUIT, PBGA381 31 X 31 MM, PACKAGE-381
Solid State Disk On Chip (SSDoC)
|
Micross Components
Austin Semiconductor, Inc
|
| 1N5224B 1N5242B 1N5230B 1N5236B 1N5246B |
FKCVR 2.5/16-STF 技术规格玻璃硅稳压二极
surface mount silicon Zener diodes 硅表面贴装齐纳二极管
|
DC Components Co., Ltd.
|
| S72WS-N S72WS512NEG-LY S72WS512NFG-LY S72WS512NFG- |
Based MCP/PoP Products 基于MCP流行产品
Based MCP/PoP Products SPECIALTY MEMORY CIRCUIT, PBGA137
|
Spansion Inc.
Spansion, Inc.
|
| 2-1418883-1 |
AMP MCP 1.5K / AMP MCP 2.8 REC. HOUSING, 62POS., SEALED
AMP MCP 1.5K / AMP MCP 2.8 REC. HOUSING, 62POS., SEALED
|
Tyco Electronics
|
| AM49DL320BGB701T AM49DL320BGT701T AM49DL320BGT701S |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM 32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous 堆叠式多芯片封装（MCP）闪存和SRAM2兆位个M × 8 2米x 16位）.0伏的CMOS只，同时
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM 32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous 堆叠式多芯片封装（MCP）闪存和SRAM2兆位4个M × 8 2米x 16位）.0伏的CMOS只，同时
32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memory and 32 Mbit (2M x 16-Bit) Pseudo Static RAM SPECIALTY MEMORY CIRCUIT, PBGA73
|
Spansion, Inc.
Spansion Inc.
ADVANCED MICRO DEVICES INC
Advanced Micro Devices, Inc.
|
| 1N4580AUR-1 CDLL4580 CDLL4580A 1N4570AUR- 1N4565AU |
QC 1,5/11-STF 温补参考稳压二极管
Temperature Compensated Zener Reference Diodes(温度补偿齐纳基准二极 参考温度补偿齐纳二极管（温度补偿齐纳基准二极管
One of Two Noninverting Demultiplexer with 3-State Deselected Output 6-DSBGA -40 to 85 温补参考稳压二极管
|
Compensated Deuices Incorpo...
Compensated Devices Incorporated
CDI-DIODE[Compensated Deuices Incorporated]
PHOENIX CONTACT Deutschland GmbH
Microsemi, Corp.
|
| A82DL3234 A82DL3244 A82DL3224UG-70 A82DL3224TG-70 |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL32x4T(U) 32 Megabit (4Mx8 Bit/2Mx16 Bit) CMOS 3.3 Volt-only, Simultaneous Operation Flash 堆叠式多芯片封装（MCP）闪存和SRAMA82DL32x4T（ü）32兆位Mx8 Bit/2Mx16位）的CMOS 3.3伏只，同时闪电行
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL32x4T(U) 32 Megabit (4Mx8 Bit/2Mx16 Bit) CMOS 3.3 Volt-only, Simultaneous Operation Flash 堆叠式多芯片封装（MCP）闪存和SRAM，A82DL32x4T（ü）32兆位Mx8 Bit/2Mx16位）的CMOS 3.3伏只，同时闪电行
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL32x4T(U) 32 Megabit (4Mx8 Bit/2Mx16 Bit) CMOS 3.3 Volt-only, Simultaneous Operation Flash 堆叠式多芯片封装（MCP）闪存和SRAM，A82DL32x4T（ü）32兆位4Mx8 Bit/2Mx16位）的CMOS 3.3伏只，同时闪电行
|
AMIC Technology, Corp.
AMIC Technology Corporation
|
| AM70PDL127BDH66IS AM70PDL127BDH66IT AM70PDL127BDH8 |
Stacked Multi-Chip Package (MCP/XIP) Flash Memory, Data storage MirrorBit Flash, and pSRAM (XIP) 堆叠式多芯片封装（MCP / XIP）的快闪记忆体，数据存储的MirrorBit闪存和移动存储芯片（XIP）的
2 x 64 Megabit (8 M x 16-Bit) CMOS 3.0 Volt-Only Page Mode Flash Memory Data Storage 128 Megabit (8 M x 16-Bit) CMOS 2 × 64兆位米16位）的CMOS 3.0伏特，只有页面模式闪存数据存28兆位米16位）的CMOS
|
Spansion, Inc.
Spansion Inc.
|
| KA100O015E-BJTT |
MCP Specification
|
Samsung semiconductor
|
| MB84VD22280FE-70 MB84VD22280FA-70 MB84VD22290FE-70 |
2-Stacked MCP
|
Fujitsu
|
| K522H1HACF-B050 |
MCP Specification
|
Samsung semiconductor
|
