| PART |
Description |
Maker |
| MMBZ5250B |
Planar Die Construction
|
TY Semiconductor Co., Ltd
|
| DPLS160-7 |
1000 mA, 60 V, PNP, Si, SMALL SIGNAL TRANSISTOR GREEN, PLASTIC PACKAGE-3
Epitaxial Planar Die Construction
|
Diodes, Inc.
Diodes Incorporated
|
| BZT52C2V0S12 BZT52C6V2S BZT52C7V5S-7-F BZT52C8V2S- |
Zener Diodes
Planar Die Construction
SURFACE MOUNT ZENER DIODE
|
Diodes Incorporated
|
| UMB10MN |
Glass Passivated Die Construction
|
DIYI Electronic Technol...
|
| SAC7.0 SAC12 |
Glass Passivated Die Construction
|
Shanghai Semitech Semic...
|
| 408-8737 |
The die assembly consists of an indenter die and nest die. Each die is held in the tool by a single screw
|
Tyco Electronics
|
| DXO885915-5 |
Planar Resonator Construction
|
SYNERGY MICROWAVE CORPO...
|
| TIP117 |
EPITAXIAL PLANAR PNP TRANSISTOR (MONOLITHIC CONSTRUCTION WITH BUILT IN BASE-EMITTER SHUNT RESISTORS INDUSTRIAL USE.)
|
KEC[KEC(Korea Electronics)]
|
| 2SPT6341SD |
MultiEpitaxial Planar NPN Power Transistor Die
|
Solid States Devices, Inc
|
| CPSL |
Low Value, Commercial Power, Four Lead, Fireproof Inorganic Construction, Current Sensing, High Power/Size Ratio, Complete Welded Construction, High Thermal Conductivity and Moisture Resistance for Aqueous Board Wash Systems
|
Vishay
|
| 1212691 |
Replacement die - CF 500/DIE RCI 6-1
|
PHOENIX CONTACT
|
| AM29BL802C_03 AM29BL802C AM29BL802CB80DGE1 AM29BL8 |
Am29BL802C (Known Good Die Supplement)
8 Megabit (512 K x 16-Bit) CMOS 3.0 Volt-only, Burst-mode, Boot Sector Flash Memory-Die Revision 1
|
Advanced Micro Devices
SPANSION[SPANSION]
|
