| PART |
Description |
Maker |
| YG101-IC112 |
Surface-mounted chip LED device
|
Seoul Semiconductor
|
| HBFR113-S |
Surface-mounted chip LED device
|
Seoul Semiconductor
|
| SSC-UR202 |
Surface-mounted and leadless chip LED device
|
Seoul Semiconductor
|
| BCR08DS-14A BCR08DS-14A-T13B10 |
Triac Low Power Use Planar Passivation Type Surface Mounted Type
|
Renesas Electronics Corporation
|
| 1PS79SB70 1PS76SB70 BAS70-06W BAS70-06 BAS70-04 BA |
General-purpose Schottky diodes in small Surface-Mounted Device (SMD) plastic packages.
|
NXP Semiconductors N.V.
|
| YGFR411-H-12 |
Surface-mounted chip LED device
Small size suitable for compact appliances
|
Seoul Semiconductor
|
| Z1SMA200 Z1SMA110 Z1SMA130 |
200 V, 5 mA, 1 W surface mounted glass passivated zener diode
110 V, 5 mA, 1 W surface mounted glass passivated zener diode
130 V, 5 mA, 1 W surface mounted glass passivated zener diode
|
Fagor
|
| SS210 |
SURFACE MOUNT SCHOTTKY BARRIER RECTIFIER For surface mounted applications
|
Chendahang Electronics Co., Ltd
|
| SK1200 SK1150 |
SURFACE MOUNT SCHOTTKY BARRIER RECTIFIER For surface mounted applications
|
Chendahang Electronics Co., Ltd
|
| 0546987003 54698-7003 |
0.80mm (.031) Pitch S.O. DIMM Socket, Right Angle, Surface Mount, 5.20mm (.205)Mounted Height, 144 Circuits, 3.3V Power Supply, Hard Tray Packaging, Height11.00mm (.433) Type, Lead-free
|
Molex Electronics Ltd.
|
| 4816P-1-472 4816P-1-221 4814P-1 4814P-3 4816P-1-10 |
4800P Series - Thick Film Surface Mounted Medium Body
Thick Film Surface Mounted Medium Body Tape and reel packaging standard
Thick Film Surface Mounted Medium Body Tape and reel packaging standard
|
Bourns Electronic Solutions
Bourns Electronic Solut...
|
| 2SD2201 |
Surface mount type device making the following possible. Large current capacity.
|
TY Semiconductor Co., Ltd
|
