| PART |
Description |
Maker |
| SP3243UCY/TR SP3223UCY/TR SP3243UCR/TR SP3243UET/T |
Surround-Sound CODEC IC; IC Function:Surround-Sound CODEC IC; Package/Case:52-MQFP; Leaded Process Compatible:No; No. of Bits:24; Operating Temp. Max:85 C; Operating Temp. Min:-40 C; Peak Reflow Compatible (260 C):No RoHS Compliant: Yes
5V High-Speed RS-232 Transceivers with 0.1uF Capacitors
Surround-Sound CODEC IC; IC Function:Surround-Sound CODEC IC; Package/Case:52-MQFP; IC Generic Number:42438; Leaded Process Compatible:No; Number
Surround-Sound CODEC IC; IC Function:Surround-Sound CODEC IC; Package/Case:64-LQFP; Leaded Process Compatible:No; No. of Bits:24; No. of Channels:8
Surround-Sound CODEC IC; IC Function:Surround-Sound CODEC IC; Package/Case:64-LQFP; IC Generic Number:CS42416; Leaded Process Compatible
Surround-Sound CODEC IC; IC Function:Surround-Sound CODEC IC; Package/Case:28-SSOP; Leaded Process Compatible:No; No. of Bits:24; No. of Channels:3
Audio CODEC IC; IC Function:Audio Codec; Package/Case:52-MQFP; Leaded Process Compatible:No; No. of Channels:6; Operating Temp. Max:85 C; Operating Temp. Min:-40 C; Peak Reflow Compatible (260 C):No; Sink Output Current:10uA RoHS Compliant: Yes
High Speed Intelligent 3.0V to 5.5V RS-232 Transceivers
|
http://
Sipex Corporation
|
| DS5003FPM-16 |
8-BIT, MICROPROCESSOR, PQFP80 ROHS COMPLIANT, MQFP-80
|
Maxim Integrated Products, Inc.
|
| P2288-03 |
MCU CMOS 44 LD 33MHZ 2K EPRM, -40C to 85C, 44-MQFP, TRAY
|
Golledge Electronics, Ltd.
|
| BZT52C4V7LP BZT52C3V3LP BZT52C3V6LP BZT52C3V0LP BZ |
Ultra-Small Leadless Surface Mount Package Ideally Suited for Automated Assembly Processes
Ultra-Small Leadless Surface Mount Package Ideally Suited for Automated Assembly Processes
|
Diodes Incorporated
|
| HSM107S |
MPAK package is suitable for high density surface mounting and high speed assembly.
|
TY Semiconductor Co., Ltd
|
| 2200166 |
Plug-in assembly reduces assembly time and therefore saves costs
|
PHOENIX CONTACT
|
| IRFK4H150 IRFK4J150 IRFK4HC50 IRFK4H350 IRFK4J054 |
400V SINGLE HEXFET Power MOSFET in a TO-240AA package
ISOLATED BASE POWER HEX PAK ASSEMBLY PARALLEL CHIP CONFIGURATION
|
IRF[International Rectifier]
|
| MDRC |
Dual Inline Package, Molded DIP, 16 Pin, Rugged, Molded Case Construction, Highly Stable, Automatic Insert Compatible, Reduces Assembly Costs
|
Vishay
|
| P4C168-30SC P4C168-30DC P4C168-30DMB P4C168-30PC P |
Temp Sensor & Brushless DC Fan Controller/Fan Fault Detect/Over Temp Alert, -40C to 125C, 8-MSOP, T/R
3-1/2 Digit A/D, w/ LED Driver, -25C to 85C, 40-PDIP, TUBE
3-1/2 Digit A/D, w/ LED Driver, -25C to 85C, 40-CERDIP 600mil, TUBE
3-1/2 Digit A/D, w/ LED Driver, 0C to 70C, 44-PLCC, TUBE
3-1/2 Digit A/D, w/LCD Driver, -25C to 85C, 44-MQFP, T/R
3-1/2 Digit A/D, w/ LED Driver, 0C to 70C, 44-MQFP, TRAY
x4 SRAM x4的SRAM
Temp Sensor & Brushless DC Fan Controller/Fan Fault Detect/Over Temp Alert, -40C to 125C, 8-MSOP, T/R
|
Electronic Theatre Controls, Inc.
|
| IRFIZ34G IRFIZ34GPBF |
60V Single N-Channel HEXFET Power MOSFET in a TO-220 FullPak (Iso) package
Lsolated Base Power HEX-pak Assembly Half Bridge Configuration
|
IRF[International Rectifier]
|
| MDP16-46 MDP16-45 |
Dual Inline Package, Molded DIP, Rugged, Molded Case Construction, Highly Stable, Automatic Insert Compatible, Available in Tube Pack, Reduces Assembly Costs
|
Vishay
|
| KBPC810 KBPC8005 KBPC801 KBPC802 KBPC804 KBPC806 K |
1000V Bridge in a D-72 package
50V Bridge in a D-72 package
100V Bridge in a D-72 package
200V Bridge in a D-72 package
400V Bridge in a D-72 package
600V Bridge in a D-72 package
800V Bridge in a D-72 package
|
International Rectifier
|
