| PART |
Description |
Maker |
| G65SC22PEI3 G65SC22PEI1 G65SC22PEI2 G65SC22PEI4 G6 |
CMOS VERSATILE INTERFACE ADAPTER WITH INTERVAL TIMER/COUNTERS
Tantalum Molded Capacitor; Capacitance: 150uF; Voltage: 10V; Case Size: 7.3x4.3 mm; Packaging: Tape & Reel 的CMOS多功能接口适配器间隔计时器/计数
Tantalum Molded Capacitor; Capacitance: 22uF; Voltage: 10V; Packaging: Tape & Reel
Tantalum Molded Capacitor; Capacitance: 2.2uF; Voltage: 10V; Case Size: 3.2x1.6 mm; Packaging: Tape & Reel
Tantalum Molded Capacitor; Capacitance: 150uF; Voltage: 10V; Case Size: 7.3x4.3 mm; Packaging: Tape & Reel
Peripheral Interface
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California Micro Devices Co...
California Micro Devices Corporation
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| G751-2P8 G751 G751-1P1 G751-2P1 |
Tantalum Conformal-Coated Capacitor; Capacitance: 33uF; Voltage: 6.3V; Case Size: 1.6x3.2 mm; Packaging: Tape & Reel
Tantalum Conformal-Coated Capacitor; Capacitance: 33uF; Voltage: 6.3V; Packaging: Tape & Reel
Tantalum Conformal-Coated Capacitor; Capacitance: 33uF; Voltage: 6.3V; Case Size: 1.6x3.2 mm; Packaging: Tape & Reel
Tantalum Conformal-Coated Capacitor; Capacitance: 33uF; Voltage: 6.3V; Packaging: Tape & Reel
Digital Temperature Sensor and Thermal Watchdog with Two-Wire Interface
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Global Mixed-mode Technology Inc.
GMT[Global Mixed-mode Technology Inc]
|
| SG-636PTF SG-636PCE SG-636PCW SG-636PH SG-636PHW S |
Tantalum Molded Capacitor; Capacitance: 100uF; Voltage: 4V; Case Size: 3.5x2.8 mm; Packaging: Tape & Reel 高频晶体振荡
Tantalum Molded Capacitor; Capacitance: 10uF; Voltage: 4V; Case Size: 4x3.2 mm; Packaging: Tape & Ammo 高频晶体振荡
HIGH-FREQUENCY CRYSTAL OSCILLATOR 高频晶体振荡
Tantalum Molded Capacitor; Capacitance: 22uF; Voltage: 4V; Case Size: 2x1.3 mm; Packaging: Tape & Reel
Tantalum Molded Capacitor; Capacitance: 10uF; Voltage: 4V; Case Size: 4x3.2 mm; Packaging: Tape & Ammo
Tantalum Molded Capacitor; Capacitance: 2.2uF; Voltage: 4V; Case Size: 2x1.3 mm; Packaging: Tape & Reel
Tantalum Molded Capacitor; Capacitance: 3.3uF; Voltage: 4V; Case Size: 2x1.25 mm; Packaging: Tape & Ammo
Tantalum Molded Capacitor; Capacitance: 100uF; Voltage: 4V; Case Size: 3.5x2.8 mm; Packaging: Tape & Reel
Tantalum Molded Capacitor; Capacitance: 3.3uF; Voltage: 4V; Case Size: 4x3.2 mm; Packaging: Tape & Ammo
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Electronic Theatre Controls, Inc.
Epson ToYoCom
ETC[ETC]
List of Unclassifed Manufacturers
|
| PSR54-9P PSA55-9R PSA55-7I PSR53-7R PSR53-9P PSR53 |
60V Single N-Channel Hi-Rel MOSFET in a TO-204AE package; A IRF054 with Standard Packaging
Analog IC
Fully optimized solution for high current synchronous buck multiphase applications in a LGA power block.; Similar to the iP2003A in Tape and Reel packaging.
500V Single N-Channel Hi-Rel MOSFET in a TO-259AA package; A IRFI460 with Standard Packaging
400V Single N-Channel Hi-Rel MOSFET in a TO-257AA package; A IRFY340CM with Standard Packaging
Synchronous Buck Multiphase Optimized BGA Power Block.; Tape and Reel version of the iP2002
-100V Single P-Channel Hi-Rel MOSFET in a 18-pin LCC package; A IRFE9110 with Standard Packaging
Synchronous Buck Multiphase Optimized BGA Power Block.; A IP2002 with Standard Packaging
-100V Single P-Channel Hi-Rel MOSFET in a TO-205AF package; A JANTXV2N6845 with Standard Packaging 模拟IC
Dual Output Full Function 2 Phase Synchronous Buck Power Block, Integrated Power Semiconductors, PWM Controller and Passives.; A IP1202 with Standard Packaging 模拟IC
|
TE Connectivity, Ltd.
|
| 87759-0874 |
2.00mm (.079 (15μ Cap, Tape and Reel Packaging, Lead-free
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Molex Electronics Ltd.
|
| 87891-1818 |
2.54mm (.100) Pitch KK庐 Header, Through Hole, Breakaway, Vertical, 18 Circuits, 0.38渭m (15渭) Gold (Au) Plating, with Cap, Tape on Reel Packaging, Lead-free
2.54mm (.100) Pitch KK? Header, Through Hole, Breakaway, Vertical, 18 Circuits, 0.38μm (15μ) Gold (Au) Plating, with Cap, Tape on Reel Packaging, Lead-free
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Molex Electronics Ltd.
|
| 87891-2818 0878912818 |
2.54mm (.100) Pitch KK? Header, Through Hole, Breakaway, Vertical, 28 Circuits, 0.38μm (15μ) Gold (Au) Plating, with Cap, Tape on Reel Packaging, Lead-free
2.54mm (.100) Pitch KK垄莽 Header, Through Hole, Breakaway, Vertical, 28 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Plating, with Cap, Tape on Reel Packaging, Lead-free
|
Molex Electronics Ltd.
|
| 1.5KA30A 1.5KA10 1.5KA10A 1.5KA11 1.5KA11A 1.5KA12 |
AUTOMOTIVE TRANSIENT VOLTAGE SUPPRESSOR
Tantalum Conformal-Coated Capacitor; Capacitance: 4.7uF; Voltage: 25V; Case Size: 1.7x3.2 mm; Packaging: Tape & Reel 汽车瞬态电压抑制器
AUTOMOTIVE TRANSIENT VOLTAGE SUPPRESSOR 汽车瞬态电压抑制器
Tantalum Conformal-Coated Capacitor; Capacitance: 2.2uF; Voltage: 25V; Packaging: Tape & Reel
Automotive Transient Voltage Suppressor(汽车瞬变电压抑制
Tantalum Conformal-Coated Capacitor; Capacitance: 4.7uF; Voltage: 25V; Case Size: 1.7x3.2 mm; Packaging: Tape & Reel
|
GE Security, Inc.
General Semiconductor
|
| UUD1H470MCL1GS UUD1V4R7MCL1GS UUD1C270MCL1GS |
Aluminum Electrolytic SMT Low Impedance Capacitor; Capacitance: 47uF; Voltage: 50V; Case Size: 6.3x7.7 mm; Packaging: Tape & Reel CAPACITOR, ALUMINUM ELECTROLYTIC, NON SOLID, POLARIZED, 50 V, 47 uF, SURFACE MOUNT
Aluminum Electrolytic SMT Low Impedance Capacitor; Capacitance: 4.7uF; Voltage: 35V; Case Size: 4x5.8 mm; Packaging: Tape & Reel CAPACITOR, ALUMINUM ELECTROLYTIC, NON SOLID, POLARIZED, 35 V, 4.7 uF, SURFACE MOUNT
Aluminum Electrolytic SMT Low Impedance Capacitor; Capacitance: 27uF; Voltage: 16V; Case Size: 5x5.8 mm; Packaging: Tape & Reel CAPACITOR, ALUMINUM ELECTROLYTIC, NON SOLID, POLARIZED, 16 V, 27 uF, SURFACE MOUNT
|
Nichicon, Corp.
|
| 0878980568 87898-0568 |
2.54mm (.100) Pitch KK? Header, Surface Mount, Breakaway, Vertical, 5 Circuits, 2.54μm (100μ) Tin (Sn) Plating, Tape on Reel Packaging, with Cap, Lead-free
2.54mm (.100) Pitch KK垄莽 Header, Surface Mount, Breakaway, Vertical, 5 Circuits, 2.54楼矛m (100楼矛) Tin (Sn) Plating, Tape on Reel Packaging, with Cap, Lead-free
|
Molex Electronics Ltd.
|
| AM29F800BT-90WBC AM29F800BT-55WBI AM29F800BB-55WBE |
and flexible way to implement power solutions for the latest high performance CPUs and ASICs.; Same as IR3087 with bag packaging
30V Single N-Channel HEXFET Power MOSFET in a I-Pak package; Similar to IRFU3709Z with Lead Free Packaging
40V Single N-Channel HEXFET Power MOSFET in a SO-8 package; Similar to IRF7470 with Lead Free Packaging
Complete VR11.0 or AMD PVID power solution.; A IR3505M packaged on tape and reel 3000 per reel
8 PWM 400 KHz Sync Contr in a 8-Pin SOIC(NB) package; A IRU3037ACS with Standard Packaging
55V Single N-Channel HEXFET Power MOSFET in a D2-Pak package; Similar to IRLZ44NS with Lead Free Packaging
The XPHASE Control IC combined with an IR XPhase TM Phase IC provides a full featured and flexible way to implement a complete an Opteron or Athlon 64 power solution.; A IR3082M with Tape and Reel Packaging
55V Single N-Channel HEXFET Power MOSFET in a SOT-223 package; Similar to IRLL024Z with Lead Free Packaging
55V Single N-Channel HEXFET Power MOSFET in a SOT-223 package; A IRLL2705 with Standard Packaging
75V Single N-Channel HEXFET Power MOSFET in a TO-262 Package; Similar to IRF2807ZL with Lead Free Packaging
55V Single N-Channel HEXFET Power MOSFET in a D2-Pak package; Similar to IRF3805S with Lead Free Packaging
x8/x16 Flash EEPROM x8/x16闪存EEPROM
XPHASE VRD10 Control IC with VccVid and Overtemp Detect; Similar to IR3080M with Lead Free Packaging on Tape and Reel x8/x16闪存EEPROM
XPHASE IC with Fault and Overtemp Detect; Same as the IR3088AM with Tape and Reel Packaging. x8/x16闪存EEPROM
8 Megabit (1 M x 8-Bit/512 K x 16-Bit) CMOS 5.0 Volt-only, Boot Sector Flash Memory 512K X 16 FLASH 5V PROM, 70 ns, PDSO48
8 Megabit (1 M x 8-Bit/512 K x 16-Bit) CMOS 5.0 Volt-only, Boot Sector Flash Memory 512K X 16 FLASH 5V PROM, 70 ns, PDSO44
8 Megabit (1 M x 8-Bit/512 K x 16-Bit) CMOS 5.0 Volt-only, Boot Sector Flash Memory 512K X 16 FLASH 5V PROM, 150 ns, PDSO48
8 Megabit (1 M x 8-Bit/512 K x 16-Bit) CMOS 5.0 Volt-only, Boot Sector Flash Memory 512K X 16 FLASH 5V PROM, 150 ns, PDSO44
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Linear Technology, Corp.
ATM Electronic, Corp.
Integrated Device Technology, Inc.
Advanced Micro Devices, Inc.
|
| KA7305 |
Tantalum Conformal-Coated Capacitor; Capacitance: 3.3uF; Voltage: 16V; Packaging: Tape & Reel
B/W CCD PROCESSOR
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SAMSUNG SEMICONDUCTOR CO. LTD.
SAMSUNG[Samsung semiconductor]
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