| PART |
Description |
Maker |
| LPD100-25B LPD100-40B LPD100-15B LPD100-20B LPD100 |
Low Pressure Drop Heat Sink
|
ALPHA
|
| ATS037037025-PF-12X |
37.00 x 37.00 x 25.00 mm BGA Heat Sink (Heat Aspect Ratio Ext.) Custom Pin Fin
|
Advanced Thermal Solutions, Inc.
|
| ATS-55250R-C1-R0-17 |
High efficiency cross-cut fin design provides low pressure drop characteristics
|
Advanced Thermal Soluti...
|
| ATS-55210R-C1-R0 |
High Performance X-CUT - Heat Sink, T412, BLACK-ANODIZED
High Perfomance X-CUT - Heat Sink, T412, BLACK-ANODIZED
|
Advanced Analog Technology, Inc.
Advanced Thermal Solutions, Inc.
|
| ATS-19G-03-C2-R0 |
Heat Sink Assembly
|
Advanced Thermal Soluti...
|
| ATS-19G-116-C2-R0 |
Heat Sink Assembly
|
Advanced Thermal Soluti...
|
| C60-075-VE C60-075-AE B60-075-AE B60-075-VE |
Heat Sink System
|
Ohmite Mfg. Co.
|
| NTE424 |
Non-Silicone Heat Sink Compound
|
NTE Electronics, Inc.
|
| ATS-312-EXL-R0 |
HEAT SINK THERMAL RESISTANCE
|
Advanced Thermal Solutions, Inc.
|
| NTE424 |
Non-Silicone Heat Sink Compound
|
NTE[NTE Electronics]
|
| CP308 CP3010 CP300 CP306 CP304 CP302 CP301 |
SINGLE-PHASE SILICON BRIDGE-P.C. MTG 2A, HEAT-SINK MTG 3A 单相硅桥式PC的MTG的甲，热沉MTG3A
SINGLE-PHASE SILICON BRIDGE-P.C. MTG 2A/ HEAT-SINK MTG 3A
|
Transys Electronics, Ltd.
TRSYS
|
| ATS-1101-C1-R0 |
Heat Sink for Quarter Brick DC-DC Converter
|
Advanced Thermal Soluti...
|
