| PART |
Description |
Maker |
| G615B G61XB G618B G611B G619B |
MULTI-ELEMENT LED LIGHT SOURCE
T-1, (3-mm) Round, PCB Mount, Right Anle Array, G61XB Series
Tantalum Molded Capacitor; Capacitance: 68uF; Voltage: 4V; Case Size: 2.8x1.9 mm; Packaging: Tape & Reel
Tantalum Molded Capacitor; Capacitance: 220uF; Voltage: 2.5V; Packaging: Tape & Reel
Tantalum Molded Capacitor; Capacitance: 220uF; Voltage: 4V; Packaging: Tape & Reel
Tantalum Molded Capacitor; Capacitance: 33uF; Voltage: 4V; Case Size: 1.6x3.2 mm; Packaging: Tape & Reel
|
List of Unclassifed Manufacturers
ETC[ETC]
Instrument Design Engineering Associates
N.A.
Electronic Theatre Controls, Inc.
|
| G690L438T21 G691L293T92 G690L400T71 G690H463T96 G6 |
Tantalum Molded Capacitor; Capacitance: 33uF; Voltage: 16V; Case Size: 5.8x3.1 mm; Packaging: Tape & Reel
122 x 32 pixel format, LED or EL Backlight available 微处理器复位IC
Tantalum Molded Capacitor; Capacitance: 4.7uF; Voltage: 16V; Case Size: 3.4x1.9 mm; Packaging: Tape & Reel 微处理器复位IC
Microprocessor Reset IC 微处理器复位IC
CAB 6C 3#16 3#0 SKT PLUG
Tantalum Molded Capacitor; Capacitance: 33uF; Voltage: 16V; Case Size: 5.8x3.1 mm; Packaging: Tape & Reel
|
Global Mixed-mode Technology, Inc.
ETC
Global Mixed-mode Technology Inc.
|
| GBJ10K GBJ10A GBJ10B GBJ10D GBJ10G GBJ10J |
Aluminum Polymer SMT Capacitor; Capacitance: 390uF; Voltage: 4V; Case Size: 6.3x6 mm; Packaging: Tape & Reel
Aluminum Polymer SMT Capacitor; Capacitance: 1200uF; Voltage: 4V; Case Size: 10x8 mm; Packaging: Tape & Reel
GLASS PASSIVATED SINGLE-PHASE BRIDGE RECTIFIER(VOLTAGE - 50 to 800 Volts CURRENT - 10.0 Amperes)
|
PanJit International Inc.
PANJIT[Pan Jit International Inc.]
|
| TG-110 TG-112 TG-115 TG-117 TG-124 TG-123 TG-181 T |
HIGH ENERGY SPARK GAP DEVICES 高能火花隙装
Tantalum Molded Capacitor; Capacitance: 4.7uF; Voltage: 35V; Case Size: 5.8x3.1 mm; Packaging: Tape & Reel
Tantalum Molded Capacitor; Capacitance: 1uF; Voltage: 6.3V; Case Size: 2x1.25 mm; Packaging: Tape & Reel
Tantalum Molded Capacitor; Capacitance: 33uF; Voltage: 4V; Case Size: 3.2x1.6 mm; Packaging: Tape & Reel
HIGH ENERGY SPARK GAP DEVICES
|
Clare Inc
CLARE[Clare, Inc.]
CLARE[Clare Inc.]
|
| IR1150 |
Similar to the IR1150S with Tape and Reel packaging
|
IRF
|
| ANI-019 |
Tape & Reel Packaging and Orientation for Surface Mount Components
|
http://
|
| WAN-0165 |
Safe Handling and Packaging of Tape and Reel Product to be Returned
|
Wolfson Microelectronics plc
|
| TC74HC240AFWI TC74HC241AFI TC74HC244AFI TC74HC244A |
OCTAL BUS BUFFER NON INVERTED, 3-STATE OUTPUTS
OCTAL BUS BUFFER INVERTED, 3-STATE OUTPUTS
Low Capacitance 8 Line EMI Filter with ESD Protection; Package: DFN16 4.0x1.6x0.9mm, 0.5p, 2 extra test leads; No of Pins: 16; Container: Tape and Reel; Qty per Container: 4000
8 Line EMI Filter with ESD Protection 1.6 x 4.0 mm DFN Package; Package: DFN16 4.0x1.6x0.9mm, 0.5p, 2 extra test leads; No of Pins: 16; Container: Tape and Reel; Qty per Container: 4000
Low Capacitance 8 Line EMI Filter with ESD Protection, 1.6 x 4.0 mm DFN Package ; Package: DFN16 4.0x1.6x0.9mm, 0.5p, 2 extra test leads; No of Pins: 16; Container: Tape and Reel; Qty per Container: 4000
4 Line EMI Filter with ESD Protection DFN 1.35 x 3.0 mm Package; Package: DFN12 3.0x1.35, 0.5P; No of Pins: 12; Container: Tape and Reel; Qty per Container: 3000
Low Capacitance 6 Line EMI Filter with ESD Protection; Package: DFN12 3.0x1.35, 0.5P; No of Pins: 12; Container: Tape and Reel; Qty per Container: 3000
10 Line EMI Filter; Package: Flip-Chip-25 CSP; No of Pins: 25; Container: Tape and Reel; Qty per Container: 3000
TOSHIBA CMOS DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC 东芝的CMOS数字集成电路硅单
|
Toshiba Semiconductor
Toshiba Corporation
Toshiba, Corp.
|
| 6861XX14122 |
1.0MM ZIF FPC HORIZONTAL TOP CONTACT TYPE - TAPE & REEL PACKAGING
|
Wurth Elektronik GmbH & Co. KG, Germany.
|
| 87891-1817 |
2.54mm (.100) Pitch KK庐 Header, Through Hole, Breakaway, Vertical, 18 Circuits, 2.50渭m (100渭) Tin (Sn) Plating, with Cap, Tape on Reel Packaging, Lead-free
2.54mm (.100) Pitch KK? Header, Through Hole, Breakaway, Vertical, 18 Circuits, 2.50μm (100μ) Tin (Sn) Plating, with Cap, Tape on Reel Packaging, Lead-free
|
Molex Electronics Ltd.
|
| 0878980568 87898-0568 |
2.54mm (.100) Pitch KK? Header, Surface Mount, Breakaway, Vertical, 5 Circuits, 2.54μm (100μ) Tin (Sn) Plating, Tape on Reel Packaging, with Cap, Lead-free
2.54mm (.100) Pitch KK垄莽 Header, Surface Mount, Breakaway, Vertical, 5 Circuits, 2.54楼矛m (100楼矛) Tin (Sn) Plating, Tape on Reel Packaging, with Cap, Lead-free
|
Molex Electronics Ltd.
|
| KBH4 |
Tantalum Molded Capacitor; Capacitance: 10uF; Voltage: 25V; Case Size: 5.8x3.1 mm; Packaging: Tape & Reel
|
DC Components Co., Ltd.
|
