| PART |
Description |
Maker |
| HM365788H-5 HM365788K-9 HM365788K-5 HM365788N-9 HM |
x4 SRAM
ECU interface connectors; HRS No: 757-0010-2 00; Operating Temperature Range (degrees C): -30 to 105; General Description: Accessory; Retainer
Small automotive connectors; HRS No: 763-0095-7 00; Mating/Unmating Cycles: 30; Operating Temperature Range (degrees C): -30 to 105; General Description: Clamp x4的SRAM
|
TE Connectivity, Ltd.
|
| ICPL0601 ICPL0600 ICPL0611 |
DESCRIPTION
|
ISOCOM COMPONENTS
|
| 8XC251TP 8XC251SP 8XC251TA 8XC251SB 8XC251SQ 8XC25 |
Hardware Description
|
Intel Corporation
|
| 7032 |
General description
|
Taiwan Memory Technolog...
|
| I705X |
General description
|
Taiwan Memory Technolog...
|
| M14C32DD M14C32-DD |
M14C32 Die Description
|
SGS Thomson Microelectronics
STMICROELECTRONICS[STMicroelectronics]
|
| WT11I-A-HCI21 WT11I-A-AI3 WT11I-A-AI5 |
Pinout and Terminal Description
|
List of Unclassifed Man...
|
| KS7308 |
FCM
GENERAL DESCRIPTION
|
Samsung Electronic
Samsung semiconductor
|
| TMS27PC512-12DDE TMS27PC512-12DDE4 TMS27PC512-10DU |
PLCC Clip-on Adapters; Top Pin Count: 32; Bottom Pin Count: 32; Part Description: PLCC IC Clip;
Diamond Particle Interconnect GHz MLF/QFN Sockets; Top Pitch (mm): 0.5; IC Size X (mm): 4; IC Size Y (mm): 4; Socket Lid: Swivel; Max Pincount: 20; Part Description: Diamond GHz QFN/MLF Socket (ZIF);
Diamond Particle Interconnect GHz MLF/QFN Sockets; Top Pitch (mm): 0.65; IC Size X (mm): 6; IC Size Y (mm): 6; Socket Lid: Swivel; Max Pincount: 28; Part Description: Diamond GHz QFN/MLF Socket (ZIF);
x8 EPROM x8存储
FPGA Development: XILINX; Top Pin Count: 84; Bottom Pin Count: 84; Top Interface: PLCC SOCKET; Bottom Interface: PLCC PLUG; Device Specific: yes; Devices Supported: XC3020, 3030, 3042; Part Description: Xilinx FPGA adapter; x8存储
|
Maxim Integrated Products, Inc.
Clare, Inc.
TE Connectivity, Ltd.
|
| AOI4286L |
TO247 PACKAGE MARKING DESCRIPTION
|
Alpha & Omega Semiconductors
|
| AOTF12T50P |
TO220F PACKAGE MARKING DESCRIPTION
|
Alpha & Omega Semiconductors
|
