| PART |
Description |
Maker |
| AP2311GN-HF AP2311GN-HF-14 |
1.8 A, 60 V, 0.25 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp.
Advanced Power Electronics Corp.
Advanced Power Electronics ...
|
| AP2305GN-HF AP2305GN-HF-14 |
4.2 A, 20 V, 0.053 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp.
Advanced Power Electronics Corp.
Advanced Power Electron...
|
| SO-8 |
8-LEAD SMALL OUTLINE PACKAGE
|
STMicroelectronics
|
| FPT-8P-M01 |
SMALL OUTLINE L-LEADED PACKAGE
|
Fujitsu Component Limited.
FUJITSU[Fujitsu Media Devices Limited]
|
| SSOP24 |
24-LEAD SHRINK SMALL OUTLINE PACKAGE
|
STMicroelectronics
ST Microelectronics
|
| AP2328GN-HF |
Capable of 2.5V Gate Drive, Small Outline Package
|
Advanced Power Electronics Corp.
|
| AP2321GN-HF AP2321GN-HF14 |
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics Corp.
|
| AP2301AGN-HF AP2301AGN-HF-14 |
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics Corp.
Advanced Power Electron...
|
| FPT-8P-M01 |
SMALL OUTLINE L-LEADED PACKAGE 小外形L -引线封装
|
Fujitsu Limited
Fujitsu, Ltd.
|
| AP2310GN |
Simple Drive Requirement Small Package Outline Surface Mount Device
|
TY Semiconductor Co., Ltd
|
| SOT765-1 |
plastic very thin shrink small outline package; 8 leads; body width 2.3 mm
|
NXP Semiconductors
PHILIPS[Philips Semiconductors]
|
