| PART |
Description |
Maker |
| PM5945 |
SAPI DAUGHTERBOARD
|
PMC
|
| STEVAL-IDW001V1 |
Wi-Fi daughterboard for STM32F0DISCOVERY
|
ST Microelectronics
|
| FPT-20P-M04 |
DB-LM3S301 Daughterboard
|
Fujitsu Limited
|
| STEVAL-ICB002V1 |
Capacitive touch daughterboard based on the STMPE821
|
STMicroelectronics
|
| STEVAL-IFR003V1 |
RTC calibration daughterboard based on the M41T83SMY6E to be used with STEVAL-IFS012V1
|
STMicroelectronics
|
| 73651-0133 0736510133 |
2.00mm (.079") Pitch HDM庐 Board-to-Board Daughterboard Power Module, RightAngle, SMC, 3-Blade Module, 3 Circuits
2.00mm (.079) Pitch HDM? Board-to-Board Daughterboard Power Module, RightAngle, SMC, 3-Blade Module, 3 Circuits
|
Molex Electronics Ltd.
|
| 73651-0033 0736510033 |
2.00mm (.079") Pitch HDM Board-to-Board Daughterboard Power Module, Right Angle, SMC, 3-Blade Module, 3 Circuits
2.00mm (.079) Pitch HDM Board-to-Board Daughterboard Power Module, Right Angle, SMC, 3-Blade Module, 3 Circuits
|
Molex Electronics Ltd.
|
| UUD1V470MCL1G MC0.063W060311K CC0603KRX7R7BB105 |
Bill of Materials for the AM306228R1DBGEVB Daughterboard
|
ON Semiconductor
|
| HEDT-5140101 HEDT-5145104 |
DB-LM3S817 Daughterboard 高温140 - C款三通道光学增量编码器模
DK-LM3S815 Dev Kit 高温140 - C款三通道光学增量编码器模
|
Yageo, Corp.
|
|
