| PART |
Description |
Maker |
| MGF0951P |
L & S BAND GaAs FET Plastic Mold Lead-less PKG
|
Mitsubishi Electric Semiconductor
|
| MGF0952P |
L & S BAND GaAs FET [ Plastic Mold Lead-less PKG ]
From old datasheet system
|
Mitsubishi Electric Corporation
MITSUBISHI[Mitsubishi Electric Semiconductor]
|
| RQ5A030AP |
High Power small mold Package
|
Rohm
|
| LBT-125 |
Compact package based on the double-mold method
|
ETC[ETC]
|
| BYM11-50 BYM11-800 BYM11-600 BYM11-400 BYM11-100 B |
1 A, 100 V, SILICON, SIGNAL DIODE, DO-213AB PLASTIC PACKAGE-2
1 A, 1000 V, SILICON, SIGNAL DIODE, DO-213AB PLASTIC PACKAGE-2
1 A, 600 V, SILICON, SIGNAL DIODE, DO-213AB PLASTIC PACKAGE-2
Surface Mount Glass Passivated Junction Fast Switching Rectifier, Forward Current 1.0 A
|
Vishay Beyschlag
|
| HLMP-3950-LM0VR HLMP-3750-L00VR HLMP-3590-I00VR HL |
T-1 3/4 SINGLE COLOR LED, GREEN, 5 mm PLASTIC PACKAGE-2
T-1 3/4 SINGLE COLOR LED, HIGH EFFICIENCY RED, 5 mm PLASTIC PACKAGE-2
T-1 3/4 SINGLE COLOR LED, YELLOW, 5 mm PLASTIC PACKAGE-2
|
Agilent Technologies, Inc.
Electronic Theatre Controls, Inc.
|
| PS21312 |
Dual-In-Line Package Intelligent Power Module TRANSFER-MOLD TYPE INSULATED TYPE
|
Mitsubishi Electric Corporation
|
| PS21204 |
Dual-In-Line Package Intelligent Power Module TRANSFER-MOLD TYPE INSULATED TYPE
|
Mitsubishi Electric Corporation
|
| PS21205 |
Dual-In-Line Package Intelligent Power Module TRANSFER-MOLD TYPE INSULATED TYPE
|
Mitsubishi Electric Corporation
|
| PS21963-EST09 PS21963-EST |
Dual-In-Line Package Intelligent Power Module TRANSFER-MOLD TYPE INSULATED TYPE
|
Mitsubishi Electric Semiconductor
|
| BGA-320P-M06 |
PLASTIC BALL GRID ARRAY PACKAGE 320 PIN PLASTIC
|
Fujitsu Limited
|
