| PART |
Description |
Maker |
| C4777-01 |
APD module APD module integrated with peripheral circuits
|
Hamamatsu Corporation
|
| FU-318AP |
APD MODULE
|
Mitsubishi Electric
|
| C5460 C5460-01 |
APD module
|
HAMAMATSU[Hamamatsu Corporation]
|
| FU-318SAP-VM6 FU-318AP-VM6 |
APD MODULE FOR LONG WAVELENGTH BAND
|
Mitsubishi Electric Corporation
MITSUBISHI[Mitsubishi Electric Semiconductor]
|
| SD197-70-74-661 |
Cooled Large Area 10mm Red Silicon APD Module
|
List of Unclassifed Manufacturers
ETC
|
| SD197-70-74-661 |
Cooled Large Area 5mm Blue Enhanced Silicon APD Module
|
Advanced Photonix, Inc.
|
| NR8360JP-BC |
InGaAs APD for OTDR applications. With FC-UPC connector.
30 um InGaAs APD IN DIP PACKAGE FOR OTDR APPLICATION
|
NEC
CEL[California Eastern Labs]
|
| NR8500 NR8500FR-BB-AZ NR8500FR-CB-AZ NR8500CP-BC-A |
CAP 1.0PF 25V .10 PF NP0(C0G) SMD-0603 TR-7 PLATED-NI/SN
NECs 050 um InGaAs APD IN COAXIAL PACKAGE FOR 155 Mb/s AND 622 Mb/s APPLICATIONS 邻舍050微米铟镓APD的同轴包55字节/秒和622 Mb / s的应
NECs 050 um InGaAs APD IN COAXIAL PACKAGE FOR 155 Mb/s AND 622 Mb/s APPLICATIONS 邻舍050微米铟镓砷APD的同轴包55字节/秒和622 Mb / s的应
NECs φ50 μm InGaAs APD IN COAXIAL PACKAGE FOR 155 Mb/s AND 622 Mb/s APPLICATIONS
|
California Eastern Laboratories, Inc.
California Eastern Labs
|
| PGR20312 |
APD Receiver Module up to 3 Gb/s
Circular Connector; Body Material:Aluminum Alloy; Series:KPT01; No. of Contacts:32; Connector Shell Size:18; Connecting Termination:Solder; Circular Shell Style:Cable Receptacle; Circular Contact Gender:Socket RoHS Compliant: No
|
Ericsson Microelectronics
|
| G10519-14 |
InGaAs APD with preamp
|
Hamamatsu Corporation
|
| AD500-12TO |
APD with 0.2 mm2 active area
|
Sensortechnics GmbH
|
| FRM5N143DS |
InGaAs-APD/Preamp Receiver
|
List of Unclassifed Manufacturers
ETC[ETC]
|
