| PART |
Description |
Maker |
| XC1800 TMSS TDOV TDOXZ TDOZX TCKMIN TDIH TDIS TMSH |
128K X 1 CONFIGURATION MEMORY, 45 ns, PQCC20
XC1800 Series of In-System Programmable Configuration PROMs
|
XILINX INC
Xilinx Inc
Xilinx, Inc.
XILINX[Xilinx, Inc]
|
| EP1C6Q240C8N |
Supports configuration through low-cost serial configuration device
|
Altera Corporation
|
| XC1700D XC17128DDD8M XC17256DDD8M XC1736DDD8M XC17 |
From old datasheet system
QPRO Family of XC1700D QML Configuration PROMs QPRO家庭的PROM配置的XC1700D QML
QPRO Family of XC1700D QML Configuration PROMs 64K X 1 CONFIGURATION MEMORY, CDIP8
Cascadable for storing longer or multiple bitstreams
QPRO Family of XC1700D QML
|
http://
XILINX[Xilinx, Inc]
Xilinx, Inc.
Xilinx Inc
XILINX INC
|
| SD1013-3 RF115 SD1013-03 |
RF MICROWAVE TRANSISTORS 108-152 MHZ APPLICATIONS VHF BAND, Si, NPN, RF POWER TRANSISTOR
From old datasheet system
RF & MICROWAVE TRANSISTORS 108-152 MHz APPLICATIONS
|
Microsemi, Corp.
MICROSEMI[Microsemi Corporation]
|
| IRFK6J150 IRFK6H150 IRFK6H350 IRFK6J350 IRFK6JC50 |
ISOLATED BASE POWER HEX PAK ASSEMBLY PARALLEL CHIP CONFIGURATION
ISOLATED BASE POWER HEX PAK ASSEMBLY PARALLEL CHIP CONFIGURATION 隔震基电力六角巴基斯坦大会平行芯片配
Lsolated Base Power HEX-pak Assembly Half Bridge Configuration
100V SINGLE HEXFET Power MOSFET in a TO-240AA package
|
International Rectifier, Corp.
IRF[International Rectifier]
|
| MR533202J-XXTP MR533202J MR533202J-XXMA |
2,097,152-Word X 16-Bit or 4,097,152-Word X 8-Bit MASK ROM
|
OKI[OKI electronic componets]
|
| THM402020SG-10 THM402020SG-80 |
Chip-on-Glass (COG) Technology, 16 Characters x 2 Lines
2,097,152 WORDSx40 BIT DYNAMIC RAM MODULE
2/097/152 WORDSx40 BIT DYNAMIC RAM MODULE
|
Toshiba Corporation
TOSHIBA[Toshiba Semiconductor]
|
| T5744-TGS T5744-TKS T5744-05 |
High Sensitivity, Especially at Low Data Rates
|
聚兴科技股份有限公司
ATMEL Corporation
|
| PCF8537BH1 |
Industrial LCD driver for multiplex rates up to 1:8
|
NXP Semiconductors
|
