| PART |
Description |
Maker |
| IRC-PU2.2 |
Infrarot-Temperatur-Messger?te
|
ASM GmbH
|
| HYM324000GD-60 HYM324000GD-50 |
4M x 32-Bit Dynamic RAM Module SMALL OUTLINE MEMORY MODULE 4M X 32 FAST PAGE DRAM MODULE, 60 ns, ZMA72
CAP 0.5PF 50V /-0.2PF THIN-FILM SN96/AG4/NI 30PPM TR-7-PA
4M x 32 Bit DRAM Module (SO-DIMM)
-4M x 32-Bit Dynamic RAM Module SMALL OUTLINE MEMORY MODULE
|
SIEMENS A G
SIEMENS AG
SIEMENS[Siemens Semiconductor Group]
Infineon
|
| HYM328020GD-60 HYM328020GD-50 |
8M x 32-Bit Dynamic RAM Module SMALL OUTLINE MEMORY MODULE 8M X 32 FAST PAGE DRAM MODULE, 60 ns, ZMA72
8M x 32 Bit DRAM Module (SO-DIMM)
-8M x 32-Bit Dynamic RAM Module SMALL OUTLINE MEMORY MODULE
|
SIEMENS AG
SIEMENS[Siemens Semiconductor Group]
Infineon
|
| A1SJ71UC24-R2 A1SY81 A1SJ71UC24-R4 A1SNMCA-8KP A1S |
MODULE COMMS RS232
OUTPUT CARD SINK/SOURCE 32 P
MODULE COMMS RS422
MEMORY EPROM 8K GPP
INPUT CARD SINK/SOURCE 16 P
OUTPUT CARD SINK/SOURCE 16 P
MEMORY EPROM 2K
CPU MODULE 64K
通讯科的RS232模块
路RS422模块通讯
CPU MODULE 8K CPU模块8K
REMOTE I/O MODULE 远程I / O模块
|
飞思卡尔半导体(中国)有限公司
Electronic Theatre Controls, Inc.
|
| BR34E02FVT-W BR34E02NUX-W |
DDR/DDR2 (For memory module) SPD Memory
|
Rohm
|
| MCM32512S10 MCM32L512S10 MCM32512 MCM32512S70 MCM3 |
512K x 32 Bit Dynamic Random Access Memory Module 512K X 32 FAST PAGE DRAM MODULE, 80 ns, SMA72
512K x 32 Bit Dynamic Random Access Memory Module 512K X 32 FAST PAGE DRAM MODULE, 70 ns, SMA72
|
MOTOROLA[Motorola, Inc]
Panasonic, Corp.
Motorola Mobility Holdings, Inc.
|
| KMM594000A KMM594000A-7 KMM594000A-10 KMM594000A-8 |
4M x 9 CMOS SIMM Memory Module
|
Samsung Electronic
Samsung semiconductor
|
| L9D232M80SBG5 |
2 - 5.0 Gb, DDR2, 32 M [64 M] x 64/72/80 Integrated Memory Module
|
LOGIC Devices Incorpora...
|
| BR34E02FVT-3 |
Memory for Plug & Play DDR2/DDR3 SPD Memory (for Memory Modules)
|
Rohm
|
| BP3599 |
Wireless LAN Module with Flash Memory
|
ROHM
|
| SE97 |
DDR memory module temp sensor
|
NXP Semiconductors
|
