| PART |
Description |
Maker |
| 82547EI |
Dual Footprint
|
Intel Corporation
|
| MDT2016-CA |
Miniature size: 2016 footprint
|
TOKO, Inc
|
| MDT2012-CH |
Miniature size: 2012 footprint
|
TOKO, Inc
|
| BXB75-48S12FLTJ BXB75-48S05FLTJ BXB75-48S3V3FLTJ |
Industry standard footprint MTBF >1.4 million hours (Bellcore 332)
Industry standard footprint MTBF >1.4 million hours (Bellcore 332)
|
Emerson Network Power
|
| KP3812W00A16 |
Small Footprint Surface Mount Package
|
KODENSHI KOREA CORP.
|
| 93405-0808 93405-0810 93405-0816 93405-0818 93405- |
REVERSE FOOTPRINT PICOFLEX SMT HEADER
|
Molex Electronics Ltd.
|
| KP3528W00A2I |
Small Footprint Surface Mount Package
|
KODENSHI KOREA CORP.
|
| KP3528BSKA2I-JX |
Small Footprint Surface Mount Package
|
KODENSHI KOREA CORP.
|
| KP2812W00A18 |
Small Footprint Surface Mount Package
|
KODENSHI KOREA CORP.
|
| 0022436130 22-43-6130 |
2.50mm (.098) Pitch SPOX Header, Shrouded, Staggered Footprint, 13 Circuits, White
2.50mm (.098") Pitch SPOX Header, Shrouded, Staggered Footprint, 13 Circuits, White
MOLEX Connector
|
Molex Electronics Ltd.
|
