| PART |
Description |
Maker |
| SES3V3D923-2U |
Small Body Outline Dimensions
|
Surge Components
|
| RQ-16 |
16-Lead Shrink Small Outline Package [QSOP] Dimensions shown in inches
|
Analog Devices
|
| 081029132758 |
PACKAGE OUTLINE DIMENSIONS
|
Galaxy Semi-Conductor H...
|
| DFN1006-2 |
PACKAGE OUTLINE DIMENSIONS
|
Galaxy Semi-Conductor H...
|
| 506AL |
MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS
|
ONSEMI[ON Semiconductor]
|
| 369A-13 |
MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS
|
ONSEMI[ON Semiconductor]
|
| 21-0108 |
PACKAGE OUTLINE, TSSOP 4.4MM BODY, EXPOSED PAD
|
Maxim Integrated Products
|
| HCPL-M452 HCPL-M453 HCPL-4502 HCPL-0452 HCPL-0453 |
HCPL-M453 · Small Outline, 5 Lead, High Speed Optocouplers
HCPL-M452 · Small Outline, 5 Lead, High Speed Optocouplers
|
Agilent (Hewlett-Packard)
HP[Agilent(Hewlett-Packard)]
|
| AP2301EN-HF-14 |
Small Package Outline
|
Advanced Power Electron...
|
| AP1333GU-HF-14 |
Small Package Outline
|
Advanced Power Electron...
|
| TSSOP MSOP TSSOP-EP MSOP-EP |
SMALL OUTLINE PACKAGES
|
STATSCHIP[STATS ChipPAC, Ltd.]
|
| MT8LDT864HXS MT4LDT464H MT4LDT464HS MT4LDT464HX MT |
SMALL-OUTLINE DRAM MODULE
|
MICRON[Micron Technology]
|
