| PART |
Description |
Maker |
| HSD879D |
; Leaded Process Compatible:No; Peak Reflow Compatible (260 C):Yes
SILICON NPN EPITAXIAL TYPE TRANSISTOR
|
HSMC CORP.
HSMC[Hi-Sincerity Mocroelectronics]
Hi-Sincerity Microelectronics
|
| 1053660000 |
Terminal Block Jumper; Leaded Process Compatible:No; Peak Reflow Compatible (260 C):No INTERCONNECTION DEVICE
|
Weidmuller, Corp.
|
| GPPC4IG5B |
Connector assemblies, Network cables; Leaded Process Compatible:No; Peak Reflow Compatible (260 C):No RoHS Compliant: No INTERCONNECTION DEVICE
|
Panduit, Corp.
|
| CA56-21GWA CA56-21 CC56-21 CC56-21EWA CA56-21YWA C |
Multiconductor Cable; Number of Conductors:4; Conductor Size AWG:22; No. Strands x Strand Size:Solid; Jacket Material:Polyvinylchloride (PVC); Leaded Process Compatible:Yes RoHS Compliant: Yes
PC Board Connector; No. of Contacts:40; Pitch Spacing:0.05"; Mounting Type:PCB Right Angle Thru Hole; Gender:Female; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):Yes RoHS Compliant: Yes 14.2MM 4位数的显示展
D Subminiature Connector; Gender:Female; Number of Contacts:36; Contact Termination:PC Board; Body Material:Steel; Contact Plating:Gold Over Nickel; Leaded Process Compatible:No; Peak Reflow Compatible (260 C):No
14.2MM FOUR DIGIT NUMERIC DISPLAYS
|
Electronic Theatre Controls, Inc.
ETC
Kingbright Electronic
|
| 2MBI100NB-120 |
NTC Thermistor; Resistance:1Mohm; Thermistor Tolerance: /- 5%; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):Yes
IGBT MODULE ( N series )
|
FUJI ELECTRIC HOLDINGS CO., LTD.
|
| STK12C68-IM STK12C68-L45IM STK12C68-L35IM STK12C68 |
NVRAM (EEPROM Based) NVRAM中（EEPROM的基础
Fuse Holder; Mounting Type:PC Board; Body Material:Thermoplastic; Contact Material:Beryllium Copper; Contact Plating:Tin; Current Rating:3.5A; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):Yes; Series:154
Fuse Holder; Mounting Type:PC Board; Body Material:Thermoplastic; Contact Material:Beryllium Copper; Contact Plating:Tin; Current Rating:1.5A; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):Yes; Series:154
Fuse Holder; Mounting Type:PC Board Surface Mount; Body Material:Thermoplastic; Contact Material:Beryllium Copper; Contact Plating:Tin; Current Rating:1.5A; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):Yes
Fuse Holder; Body Material:Thermoplastic; Current Rating:3A; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):Yes; Series:154; Contact Material:Beryllium Copper; Contact Plating:Tin; Mounting Type:PC Board RoHS Compliant: Yes
Fuse Holder; Body Material:Thermoplastic; Current Rating:5A; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):Yes; Series:154; Contact Material:Beryllium Copper; Contact Plating:Tin; Mounting Type:PC Board RoHS Compliant: Yes
FUSE 5A LITTLEFUSE 154005
CMOS nvSRAM 8K x 8 AutoStore Nonvolatile Static RAM Industrial Temperature/Military Screen
|
N.A.
ETC[ETC]
List of Unclassifed Manufacturers
|
| 29.401.1253.0 |
Terminal Block; No. of Positions:12; Pitch Spacing:0.213"; Wire Size (AWG):22-12; Mounting Type:Panel; Leaded Process Compatible:Yes; No. of Contacts:12; Peak Reflow Compatible (260 C):No RoHS Compliant: Yes
|
WIELAND ELECTRIC INC
|
| 1581-2 |
Banana Jack; Current Rating:15A; Body Material:Brass; Color:Red; Contact Plating:Tin Over Nickel; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):Yes INTERCONNECTION DEVICE
|
Pomona Electronics
|
| HYB5117400BJ-50- Q67100-Q1088 HYB5117400BJ-50 HYB5 |
Connector Cover; Leaded Process Compatible:No; Enclosure Color:Gray; For Use With:SB 350 Connector; Peak Reflow Compatible (260 C):No RoHS Compliant: Yes 4米4位动态随机存储器
4M x 4-Bit Dynamic RAM
|
http://
SIEMENS AG
|
| OPB370 OPB360 OPB365T55 |
INDUCTOR SERIES:PM2110; INDUCTANCE:1.2UH; INDUCTANCEPROCESS COMPATIBLE:YES; CURRENT RATING:2.3A; EXTERNAE:SURFACE MOUNT; PEAK REFLOW COMPATIBLE (260 C):YES;
Slotted Op ti cal Switches
8K, 1K X 8 2.5V SERIAL EE, IND, -40C to 125C, 8-TSSOP, T/R OPTOKOPPLER晶体管AUSGANG
|
OPTEK[OPTEK Technologies]
ETC
TT electronics OPTEK Technology
|
