| PART |
Description |
Maker |
| BMC0805HF-R27K BMC BMC0402HF-10NK BMC0402HF-12NK B |
1 ELEMENT, 0.18 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
1 ELEMENT, 0.056 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
1 ELEMENT, 0.001 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
1 ELEMENT, 0.0033 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
1 ELEMENT, 0.0022 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Surface Mount Multilayer High Frequency Ceramic Chip Inductors 0402 - 0805 Industry Sizes
1 ELEMENT, 0.1 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
1 ELEMENT, 0.015 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
|
BITECH[Bi technologies]
BI Technologies Corporation
|
| I583-1P8-26.000 I783-1P8-26.000 I583-1P1-26.000 I7 |
2.0 mm x 2.5 mm Ceramic Package SMD TCXO
|
ILSI America LLC
|
| ISM89-6158AH-156.250 ISM89-3158AH-156.250 ISM89-62 |
3.2 mm x 5.0 mm Ceramic Package SMD Oscillator, LVDS
|
ILSI America LLC
|
| SMD03025-4 |
SMALLEST AVAILABLE SMD-CRYSTAL IN CERAMIC PACKAGE
|
PETERMANN-TECHNIK
|
| LXZT-374KHZ LXZT-429KHZ LXZT-249KHZ LXZT-375KHZ LX |
CERAMIC RESONATOR, 0.374 MHz ROHS COMPLIANT, CERAMIC PACKAGE-2
CERAMIC RESONATOR, 0.429 MHz ROHS COMPLIANT, CERAMIC PACKAGE-2
CERAMIC RESONATOR, 0.249 MHz ROHS COMPLIANT, CERAMIC PACKAGE-2
CERAMIC RESONATOR, 0.375 MHz ROHS COMPLIANT, CERAMIC PACKAGE-2
CERAMIC RESONATOR, 0.999 MHz ROHS COMPLIANT, CERAMIC PACKAGE-2
|
Abracon, Corp.
|
| CW201212-R33J CW201212-12NJ CW201212-R56J CW201212 |
MAGNETICS-HIGH Q CHIP INDUCTOR 1 ELEMENT, 0.33 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
MAGNETICS-HIGH Q CHIP INDUCTOR 1 ELEMENT, 0.012 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
MAGNETICS-HIGH Q CHIP INDUCTOR 1 ELEMENT, 0.56 uH, FERRITE-CORE, GENERAL PURPOSE INDUCTOR, SMD
MAGNETICS-HIGH Q CHIP INDUCTOR 1 ELEMENT, 0.91 uH, FERRITE-CORE, GENERAL PURPOSE INDUCTOR, SMD
MAGNETICS-HIGH Q CHIP INDUCTOR 1 ELEMENT, 0.0033 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Inductor; Inductor Type:High Frequency; Inductance:13.3nH; Inductance Tolerance: /- 5 %; Current Rating:600mA; Series:CW201212; Package/Case:0805; Core Material:Alumina Ceramic; Leaded Process Compatible:Yes RoHS Compliant: Yes
|
Bourns, Inc.
BOURNS INC
|
| PL0066-WCY02 |
SMD High Power LED Ceramic Package
|
P-tec Corporation
|
| LCWCP7P.PC LCW-CP7P.PC |
SMD ceramic package with silicon resin with lens
|
OSRAM GmbH
|
| LYCPDP |
SMD ceramic package with silicon resin with lens
|
OSRAM GmbH
|
| I607-1DC8H-77.760 I607-1DC9H-77.760 I607-2AB9H-77. |
5 mm x 7 mm Ceramic Package SMD VCXO, LVPECL / LVDS
|
ILSI America LLC
|
| PM1008-10NM-RC PM1008-18NM-RC PM1008-12NM-RC PM100 |
High Q Chip Inductors
SMD Inductor; Series:PM1008; Inductance:120nH; Inductance Tolerance: /- 10 %; Q Factor:60; Self Resonant Frequency:950MHz; Package/Case:1008; Terminal Type:PCB Surface Mount; Core Material:Ceramic; Current Rating:650mA
SMD Inductor; Series:PM1008; Inductance:680nH; Inductance Tolerance: /- 10 %; Q Factor:45; Self Resonant Frequency:375MHz; Package/Case:1008; Terminal Type:PCB Surface Mount; Core Material:Ceramic; Current Rating:400mA
SMD Inductor; Series:PM1008; Inductance:390nH; Inductance Tolerance: /- 10 %; Q Factor:45; Self Resonant Frequency:500MHz; Package/Case:1008; Terminal Type:PCB Surface Mount; Core Material:Ceramic; Current Rating:470mA
SMD Inductor; Series:PM1008; Inductance:820nH; Inductance Tolerance: /- 10 %; Q Factor:45; Self Resonant Frequency:350MHz; Package/Case:1008; Terminal Type:Surface Mount; Core Material:Ceramic; Current Rating:400mA
SMD Inductor; Series:PM1008; Inductance:3.3uH; Inductance Tolerance: /- 10 %; Q Factor:22; Self Resonant Frequency:110MHz; Package/Case:1008; Terminal Type:PCB Surface Mount; Core Material:Ceramic; Current Rating:290mA
|
Bourns Electronic Solutions
BOURNS INC
|
|
