| PART |
Description |
Maker |
| 2SHD-C-XX-MTR-087 |
DOUBLE ROW SHROUDED HEADER
|
Adam Technologies, Inc.
|
| 480-90-202-00-001000 480-90-264-00-001000 450-90-2 |
HEADER STRIPS .100隆卤 Grid Solder Tail Double Row
HEADER STRIPS .100 Grid Solder Tail Double Row
HEADER STRIPS .100?/a> Grid Solder Tail Double Row
TWO PART BOARD CONNECTOR
|
Mill-Max Mfg. Corp.
MILL-MAX MFG CORP
|
| 817-22-072-30 |
Interconnect Header Spring-Loaded Header Double Row Surface Mount
|
Maxim Integrated Products
Mill-Max Mfg. Corp.
|
| 0554011419 55401-1419 |
2.54mm (.100) Pitch QF-50 Flat Ribbon Cable Header, Dual Row, Vertical,Shrouded Header with Eject Levers, 14 Circuits, Lead-free
MOLEX Connector
|
Molex Electronics Ltd.
|
| 15-80-0101 70567-0003 A-70567-0003 0015800101 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, Tin (Sn) Plating
Molex Electronics Ltd.
|
Molex Electronics Ltd.
|
| 0015800281 70567-0012 15-80-0281 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, Tin (Sn) Plating
MOLEX Connector
|
Molex Electronics Ltd.
|
| 15-80-0125 0015800125 70567-0140 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, 0.76渭m (30渭") Gold (Au) Selective Pla
Molex Electronics Ltd.
|
Molex Electronics Ltd.
|
| 15-80-0089 0015800089 A-70567-0274 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, 0.38渭m (15渭) Gold, (Au) Selective Plat
Molex Electronics Ltd.
|
Molex Electronics Ltd.
|
| 15-80-0069 0015800069 A-70567-0273 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, 0.38渭m (15渭) Gold, (Au) Selective Plat
Molex Electronics Ltd.
|
Molex Electronics Ltd.
|
| 0025021028 25-02-1028 SDA-70204-0333 |
2.54mm (.100") Pitch C-Grid庐 Header, Dual Row, Shrouded, with PC Slot and Guide Ear, 28 Circuits, 0.76渭m (30渭") Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid? Header, Dual Row, Shrouded, with PC Slot and Guide Ear, 28 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
| 15-47-7732 0015477732 |
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 32 Circuits, 0.76渭m (30渭) Gold (Au) Selective Platin
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 32 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
| A-70567-0341 15-80-1061 0015801061 |
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, 0.76渭m (30渭) Gold, (Au) Selective Plat
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, 0.76μm (30μ) Gold, (Au) Selective Plating
|
Molex Electronics Ltd.
|
|
